Foundry News
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TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
(Wednesday, September 25, 2024)
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Intel's entire turnaround plan hinges on this one new chip family - Clearwater Forest pictured, Intel's first 18A chip slated for high-volume manufacturing
(Monday, September 23, 2024)
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TSMC's Strategic Win: Full-Scale Semiconductor Production Starts Ahead of Schedule
(Thursday, September 19, 2024)
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Samsung Secures US AI Chip Firm "Ambarella" Orders For Its 2nm Process, Signaling A Breakthrough
(Saturday, September 14, 2024)
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Samsung's 2nm Yield Rate at Most 20%, Withdraws Personnel from Texas Taylor Plant
(Wednesday, September 11, 2024)
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Adani Group partners Israel's Tower Semiconductor to build $10 billion chip plant in India: All details
(Thursday, September 5, 2024)
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Samsung Partners with TSMC, Its Foundry Rival, on HBM4 Development
(Thursday, September 5, 2024)
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Samsung and TSMC Unlikely to Be Buyers for Intel's Rumored Foundry Business Sale
(Monday, September 2, 2024)
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OpenAI joins Apple in securing TSMC's A16 Angstrom process for in-house AI chip
(Sunday, September 1, 2024)
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Intel considers foundry split, fab cancellations
(Sunday, September 1, 2024)
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Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
(Sunday, September 1, 2024)
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Efficient Computer signs an agreement with GlobalFoundries to build MRAM chips on the GF 22FDX process
(Saturday, August 31, 2024)
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Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA process and 2.5D Package to Preferred Networks
(Wednesday, July 10, 2024)
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Samsung Electronics To Provide Turnkey Semiconductor Solutions With 2nm GAA Process and 2.5D Package to Preferred Networks
(Monday, July 8, 2024)
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Siemens advances integrated circuit test and analysis at 5nm and below
(Monday, July 8, 2024)
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Tiny titans: Unveiling the power of 2nm and 1nm chips
(Monday, July 8, 2024)
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TSMC Reportedly Secures 3nm Order After Tapeout for Google's Tensor G5
(Wednesday, July 3, 2024)
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eMemory's Security-Enhanced OTP Qualifies on TSMC N5A Process Specializing in High-Performance Automotive Chips
(Tuesday, July 2, 2024)
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Building Intel's Foundry Ecosystem for the AI Era
(Sunday, June 30, 2024)
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Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications
(Wednesday, June 26, 2024)
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Intel 3 '3nm-class' process technology is in high-volume production
(Tuesday, June 18, 2024)
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QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs
(Monday, June 17, 2024)
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Intel 3 Represents an Intel Foundry Milestone
(Monday, June 17, 2024)
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Samsung Foundry Struggles with Yield and Power Efficiency Issues
(Monday, June 17, 2024)
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Synopsys Achieves Certification of its AI-driven Digital and Analog Flows and IP on Samsung Advanced SF2 GAA Process
(Wednesday, June 12, 2024)
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ADTechnology announces next-generation platform "ADP600" at Samsung Foundry Forum 2024
(Wednesday, June 12, 2024)
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Siemens collaborates with Samsung Foundry to expand 3D-IC enablement tools, optimize other EDA solutions for foundry's newest processes
(Wednesday, June 12, 2024)
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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology
(Wednesday, June 12, 2024)
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Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
(Wednesday, June 12, 2024)
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Alphawave Semi Expands Partnership with Samsung Foundry to Further Drive Innovation at Advanced Semiconductor Nodes
(Monday, June 10, 2024)
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OPENEDGES Announces Silicon-Proven Success of its LPDDR5X Combo PHY IP on Samsung Foundry's SF5A Technology
(Sunday, June 9, 2024)
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Samsung Foundry Expands 'Packaging Coalition' with Ten Additional Members
(Wednesday, June 5, 2024)
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ElevATE Semiconductor and GlobalFoundries Partner on High-Voltage Chips for Commercial and National Security Applications
(Tuesday, June 4, 2024)
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Qualcomm is considering a "dual-sourcing" strategy with Samsung and TSMC for Snapdragon 8 Gen 5
(Tuesday, June 4, 2024)
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Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
(Sunday, June 2, 2024)
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Samsung Electronics Opens Path to Chase TSMC with 3nm Foundry Collaboration with AMD
(Tuesday, May 28, 2024)
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Samsung Expected to Unveil its 1nm Plan in June, Advancing it to 2026
(Tuesday, May 28, 2024)
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TSMC's 3nm Production Capacity Will Triple This Year! Nanjing Plant Receives "Indefinite Exemption"!
(Thursday, May 23, 2024)
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X-FAB and Soitec team up on SiC wafers
(Wednesday, May 22, 2024)
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IMEC Spearheads the Construction of Sub-2nm Pilot Line Project with a Fund of EUR 2.5 Billion
(Wednesday, May 22, 2024)
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Soitec and Tokai Carbon enter into SiC partnership
(Tuesday, May 21, 2024)
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Fraunhofer IPMS supports the 300 mm process development of smart power technologies for the semiconductor manufacturer Infineon at the Dresden site
(Monday, May 20, 2024)
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TSMC Reportedly Prepares Next-generation HBM4 Manufacturing, Utilizing 12nm and 5nm Process Nodes
(Thursday, May 16, 2024)
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Samsung tapes out 3nm mobile processor, closing gap with TSMC
(Tuesday, May 7, 2024)
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Rapidus and Fraunhofer IZM join Forces for High-End Performance Packaging
(Tuesday, May 7, 2024)
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Synopsys collaborates with TSMC on 2nm IP portfolio and photonics ICs
(Monday, May 6, 2024)
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Apple M4 moves to TSMC N3E
(Monday, May 6, 2024)
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A Conversation with GlobalFoundries Europe's Manfred Horstmann
(Sunday, May 5, 2024)
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Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
(Thursday, May 2, 2024)
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TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
(Monday, April 29, 2024)
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