Foundry News
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TSMC's A16 Process Moves Goalposts in Tech-Leadership Game
(Sunday, April 28, 2024)
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Siemens' tools certified for TSMC N2
(Sunday, April 28, 2024)
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TSMC plans 1.6nm process for 2026
(Thursday, April 25, 2024)
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Synopsys Accelerates Next-Level Chip Innovation on TSMC Advanced Processes
(Wednesday, April 24, 2024)
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Cadence and TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
(Wednesday, April 24, 2024)
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M31 has successfully launched MIPI C/D PHY Combo IP on the advanced TSMC 5nm process
(Wednesday, April 24, 2024)
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TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design
(Wednesday, April 24, 2024)
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Siemens collaborates with TSMC on design tool certifications for the foundry's newest processes and other enablement milestones
(Tuesday, April 23, 2024)
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Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
(Monday, April 22, 2024)
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Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
(Monday, April 22, 2024)
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Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
(Sunday, April 21, 2024)
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Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
(Thursday, April 18, 2024)
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STMicroelectronics opens up the FD-SOI era for MCU
(Tuesday, April 16, 2024)
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Industry Leading PPA EFPGA And DSP/AI In Development For TSMC N5/4/3
(Sunday, April 7, 2024)
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It Is Time To Take Intel Seriously As A Chip Foundry
(Thursday, April 4, 2024)
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SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
(Tuesday, March 26, 2024)
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StarIC and GlobalFoundries announce strategic partnership, release high-Speed TIA and drivers to advance silicon photonics ecosystem
(Sunday, March 24, 2024)
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TSMC and Synopsys Bring Breakthrough NVIDIA Computational Lithography Platform to Production
(Monday, March 18, 2024)
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STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers
(Monday, March 18, 2024)
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After TSMC fab in Japan, advanced packaging facility is next
(Sunday, March 17, 2024)
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Intel will bring a performance-improving feature to its chips one year ahead of TSMC
(Friday, March 15, 2024)
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We'll Need Many More Fabs to Meet $1 Trillion by 2030 Goal
(Tuesday, March 12, 2024)
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The Imminent Arrival of 2-Nanometer Advanced Process
(Monday, March 11, 2024)
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Credo Launches 112G PAM4 SerDes IP for TSMC N3 Process Technology
(Thursday, March 7, 2024)
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Flex Logix Joins Intel Foundry USMAG Alliance
(Tuesday, March 5, 2024)
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QuickLogic Announces eFPGA IP Contract for TSMC N12e™ Process Technology
(Monday, March 4, 2024)
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Intel Launches Altera, Its New Standalone FPGA Company
(Sunday, March 3, 2024)
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Intel puts 1nm process (10A) on the roadmap for 2027 - also plans for fully AI-automated factories with 'Cobots'
(Tuesday, February 27, 2024)
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Intel Foundry Services Head Sees Advanced Packaging as "On Ramp" to Growth
(Wednesday, February 21, 2024)
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Intrinsic ID Joins Intel Foundry Accelerator IP Alliance to Secure Leading-Edge Semiconductors
(Tuesday, February 20, 2024)
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Synopsys and Intel Foundry Accelerate Advanced Chip Designs with Synopsys IP and Certified EDA Flows for Intel 18A Process
(Tuesday, February 20, 2024)
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Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel's EMIB reference flow
(Tuesday, February 20, 2024)
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Intel and Cadence Expand Partnership to Enable Best-in-Class SoC Design on Intel's Advanced Processes
(Monday, February 19, 2024)
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Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology
(Monday, February 19, 2024)
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Flex Logix Joins Intel Foundry Services Accelerator IP Alliance to Enable Fast, Low Power, Reconfigurable SoC's
(Sunday, February 11, 2024)
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Qualcomm asks Samsung Foundry and TSMC to each build 2nm Snapdragon 8 prototypes
(Sunday, February 11, 2024)
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Dolphin Design announces the successful launch of its first silicon tape out in 12nm FinFet
(Wednesday, February 7, 2024)
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Samsung Announces 2nm AI Chip Deal With HBM3 Memory
(Wednesday, February 7, 2024)
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SK hynix, TSMC Form AI Semiconductor Alliance: Challenge to Samsung Electronics?
(Wednesday, February 7, 2024)
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Intel Foundry Announces 18A Design Win for 64-Core Arm SoC
(Monday, February 5, 2024)
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Faraday Announces Plans to Develop Arm-based 64-core SoC on Intel 18A Technology
(Sunday, February 4, 2024)
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Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
(Sunday, February 4, 2024)
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Both Samsung and TSMC will be keeping 2nm chip manufacturing in their home countries
(Friday, February 2, 2024)
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eMemory's Security-Enhanced OTP Qualifies on TSMC N4P Process, Pushing Forward in High-Performance Leading Technology
(Wednesday, January 24, 2024)
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Intel and UMC Announce New Foundry Collaboration
(Wednesday, January 24, 2024)
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Report: Apple will be first to receive TSMC's 2nm chips starting in 2025
(Tuesday, January 23, 2024)
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Samsung's 2nd-Gen 3nm Process, SF3, Has Begun Trial Production
(Saturday, January 20, 2024)
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Samsung and TSMC competing to dominate 2nd-gen 3nm at global foundry industry
(Wednesday, January 17, 2024)
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ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM
(Wednesday, January 17, 2024)
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Intel, Samsung, TSMC 'Getting Serious' About CFET
(Tuesday, January 9, 2024)
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