Foundry News
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GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications
(Wednesday, August 30, 2023)
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GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications
(Tuesday, August 29, 2023)
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GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles
(Tuesday, August 29, 2023)
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A New Home For Europe's Semiconductor Metrology
(Tuesday, August 22, 2023)
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TSMC Forms Task Force to Accelerate 2nm Chip Production
(Thursday, August 17, 2023)
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Samsung Establishes R&D Organization in Silicon Valley
(Wednesday, August 16, 2023)
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Intel and Synopsys Expand Partnership to Enable Leading IP on Intel Advanced Process Nodes
(Monday, August 14, 2023)
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Imec integrates thin-film pinned photodiode into short-wave-infrared imaging sensors
(Monday, August 14, 2023)
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TSMC allocates $6bn for 2nm capacity in Taiwan
(Friday, August 11, 2023)
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3-nm Race to Start in Semiconductor Industry with Chip for Apple iPhone 15
(Tuesday, August 8, 2023)
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TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
(Monday, August 7, 2023)
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Huawei planning on using SMIC to fab 7nm ICs this year
(Sunday, July 30, 2023)
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Huawei plans to use SMIC's 'nearly-7nm' process
(Sunday, July 30, 2023)
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TSMC opens global R&D centre for 1nm push
(Thursday, July 27, 2023)
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Intel Looks to Regain Semiconductor Chip Leadership from TSMC; Separates Manufacturing and Fabless Units
(Wednesday, July 26, 2023)
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Singapore opens US$2bn chiplet factory
(Sunday, July 23, 2023)
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M31 Partners with Intel IFS Alliance to Present Latest IP Development Achievements
(Thursday, July 13, 2023)
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Cadence Digital, Custom/Analog Design Flows Certified and Design IP Available for Intel 16 FinFET Process
(Tuesday, July 11, 2023)
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'Correct by construction' tool for chip power layout down to 2nm
(Monday, July 10, 2023)
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End-to-end design and verification for PCIe 6.0
(Sunday, July 9, 2023)
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Samsung tapes out 2nm backside routing test chip
(Monday, July 3, 2023)
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Rapidus CEO Chasing Single-Wafer-Processing Dream
(Sunday, July 2, 2023)
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Synopsys and Samsung Foundry Boost Power, Performance and Area for Modern SoCs on Samsung's SF2 Process
(Tuesday, June 27, 2023)
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Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023
(Tuesday, June 27, 2023)
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Intel Provides Update on Internal Foundry Model
(Wednesday, June 21, 2023)
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Samsung to apply AI, big data tech to entire chipmaking process
(Sunday, June 18, 2023)
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Samsung broadens IP portfolio to narrow gap with TSMC
(Tuesday, June 13, 2023)
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Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes
(Tuesday, June 13, 2023)
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Samsung Electronics to hoist foundry IP portfolio to narrow gap with TSMC
(Tuesday, June 13, 2023)
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TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology
(Thursday, June 8, 2023)
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TSMC studying 2nd fab in Kumamoto, focusing on mature technologies
(Monday, June 5, 2023)
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The challenges Intel faces to compete with TSMC, Samsung
(Monday, June 5, 2023)
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It's a go for the GF-ST joint FDSOI fab in Crolles
(Monday, June 5, 2023)
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Intel Foundry Services Ushers in a New Era
(Tuesday, May 30, 2023)
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Samsung's June 2023 Reveal: Enhanced 3nm & 4nm Chip Fabrication Process
(Monday, May 29, 2023)
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TSMC lays out a killer roadmap
(Wednesday, May 24, 2023)
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3nm AI chips and 6nm microcontrollers will be key to TSMC Dresden fab
(Tuesday, May 23, 2023)
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Samsung To Officially Unveil Its 3nm, 4nm Technologies In June, With Up To 34 Percent Power Efficiency Improvements
(Sunday, May 21, 2023)
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GlobalFoundries, Samsung Electronics, and TSMC Join Imec's "Sustainable Semiconductor Technologies & Systems" (SSTS) Program
(Tuesday, May 16, 2023)
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Japanese foundry Rapidus is making cutting edge 2 nm nodes with IBM, plans to compete with TSMC and Samsung by 2027
(Thursday, May 11, 2023)
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TSMC adds two variants to 2nm node; will Intel catch up?
(Tuesday, May 9, 2023)
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Samsung to Detail Second-Gen 3nm Node, But Admits It Is Behind TSMC
(Sunday, May 7, 2023)
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TSMC upends 3-nm roadmap with three new nodes
(Monday, May 1, 2023)
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TSMC Showcases New Technology Developments at 2023 Technology Symposium
(Wednesday, April 26, 2023)
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Siemens announces certifications for TSMC's latest processes, celebrates recent achievements for Siemens and TSMC collaboration
(Wednesday, April 26, 2023)
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TSMC on track to roll out advanced 2nm chips by 2025
(Wednesday, April 26, 2023)
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Synopsys, Ansys and Keysight Collaborate with TSMC to Boost Performance of Autonomous Systems with New mmWave Reference Flow
(Tuesday, April 25, 2023)
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Attopsemi's Revolutionary I-fuse® OTP Silicon-Proven on FinFET Technology
(Monday, April 24, 2023)
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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC's N3E Process Technology
(Monday, April 24, 2023)
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Analog Bits to Demonstrate Working Silicon on TSMC N3E Process at TSMC 2023 North America Technology Symposium
(Monday, April 24, 2023)
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