Design Platform News
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M31 Launches PCI-SIG Certified PCIe 5.0 PHY IP, Partnering with SSD Storage Chipmaker InnoGrit to Advance the Next-Generation PCIe 5.0
(Monday, February 19, 2024)
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T2M-IP Unveils the 12-bit 4Gsps ADC Silicon-Proven IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
(Monday, February 19, 2024)
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Imec launches the first design pathfinding process design kit for N2 node
(Sunday, February 18, 2024)
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Arm CSA and AMBA release provide boost for chiplet ecosystem
(Thursday, February 15, 2024)
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Quantum Experts discuss next Digital Revolution
(Thursday, February 15, 2024)
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AccelerComm® Joins Open Compute Project Foundation Focusing on Evenstar Modular Open RAN Radio Unit Reference Design
(Wednesday, February 14, 2024)
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Thalia releases AMALIA 24.1 with support for 12nm FinFET, porting simulation comparisons and streamlined technology analysis reporting
(Wednesday, February 14, 2024)
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OpenTitan® Partnership Makes History as First Open-Source Silicon Project to Reach Commercial Availability
(Tuesday, February 13, 2024)
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zeroRISC, Nuvoton and Winbond Join Forces to Deliver the First Commercial Product Based on the OpenTitan® Open-Source Secure Silicon Platform
(Tuesday, February 13, 2024)
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ARM bids for chiplet dominance
(Tuesday, February 13, 2024)
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What Role Will Open-Source Development Play in Quantum Computing?
(Monday, February 12, 2024)
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T2M is excited to announce the successful licensing of our partner's Silicon-Proven 1G Ethernet PHY IP Cores on a Tier-1 Foundry in Korea, using the advanced 14LPP process, in collaboration with a leading Tier-1 Korean customer
(Sunday, February 11, 2024)
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The next frontier in semiconductor innovation: Chiplets and the rise of 3D-ICs
(Sunday, February 11, 2024)
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Cadence and Dassault Systemes Unveil the First Cloud-Enabled, Collaborative Experience to Transform the Development of Electromechanical Systems
(Sunday, February 11, 2024)
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Movellus Recognized by Frost & Sullivan for Improving System Performance and Optimizing Power with Its Aeonic™ IP Portfolio
(Monday, February 5, 2024)
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Why China is betting big on chiplets
(Monday, February 5, 2024)
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Siemens brings the power of multi-discipline simulation to axial flux motor development for next-generation EVs
(Monday, February 5, 2024)
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Nordic Semiconductor and Arm reaffirm partnership with licensing agreement for latest low power processor designs, software platforms, and security IP
(Sunday, February 4, 2024)
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AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation
(Sunday, February 4, 2024)
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NoC configuration tool takes makes complex SoC design easier
(Sunday, February 4, 2024)
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Eliyan Breaks Chiplet Memory Wall With Standard Packaging
(Sunday, February 4, 2024)
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Cadence Unveils Millennium Platform - Industry's First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency
(Thursday, February 1, 2024)
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Nubis Communications and Alphawave Semi Showcase First Demonstration of Optical PCI Express 6.0 Technology
(Tuesday, January 30, 2024)
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Alphawave Semi and Teledyne LeCroy Unveil PCIe 7.0 Signal Generation and Measurement
(Tuesday, January 30, 2024)
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Satisfy Your Chiplet Craving at the Chiplet Summit
(Tuesday, January 30, 2024)
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Europe's home-grown processor
(Tuesday, January 30, 2024)
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Alphawave Semi and proteanTecs Collaborate to Provide System Insights and Analytics for Custom Silicon and Chiplets
(Monday, January 29, 2024)
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T2M-IP Unveils Best-Selling DVB-T2/T Demodulator IP Core with Cutting-Edge Features, Silicon Proven and Ready to License
(Sunday, January 28, 2024)
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INTERCHIP achieves 3x faster verification for next-gen clocking oscillator with Siemens' advanced analog and mixed-signal EDA technology
(Sunday, January 28, 2024)
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Silvaco Joins GaN Valley™, a Wide Bandgap Semiconductor Innovation Ecosystem in Europe
(Sunday, January 28, 2024)
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Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard
(Tuesday, January 23, 2024)
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SoC design: When a network-on-chip meets cache coherency
(Tuesday, January 23, 2024)
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Menta exhibits at Chiplet Summit and presents its new scalable chiplet platform, MOSAICS-LP
(Monday, January 22, 2024)
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Sondrel completes a multi-billion transistor chip design at 5nm
(Monday, January 22, 2024)
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Siemens brings thermal digital twin technology to the electronics supply chain
(Monday, January 22, 2024)
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Cadence Unveils New Palladium Z2 Apps with Industry's First 4-State Emulation and Mixed-Signal Modeling to Accelerate SoC Verification
(Thursday, January 18, 2024)
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How Synopsys' acquisition of Ansys could streamline design and simulation
(Tuesday, January 16, 2024)
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Chiplet Makers Expect to Disrupt Incumbents
(Monday, January 15, 2024)
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proteanTecs Launches Power Reduction Solution for High Performance Markets
(Monday, January 15, 2024)
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Unveiling a Cutting-Edge 12-bit 5Msps SAR ADC IP Core - Industry-Leading Features, Silicon Proven, and Available for Licensing Now
(Sunday, January 14, 2024)
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Unveiling Sonata: Affordable CHERI Hardware for Embedded Systems
(Sunday, January 14, 2024)
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High-bandwidth memory (HBM) options for demanding compute
(Sunday, January 14, 2024)
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Chip wars: How 'chiplets' are emerging as a core part of China's tech strategy
(Friday, January 12, 2024)
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[CES 2024] Samsung to continue investing in HBM in 2025
(Thursday, January 11, 2024)
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Atmosic Introduces the Multiprotocol ATM34/e Series Adding 802.15.4 Support for Thread and Matter to its Bluetooth LE Portfolio
(Tuesday, January 9, 2024)
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CXL Overcomes Hierarchical Routing Limits
(Tuesday, January 9, 2024)
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GUC Tapes Out Complex 3D Stacked Die Design on Advanced FinFET Node Using Cadence Integrity 3D-IC Platform
(Tuesday, January 9, 2024)
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GUC Taped Out UCIe 32G IP using TSMC's 3nm and CoWoS Technology
(Monday, January 8, 2024)
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Thalia's AMALIA qualified on 12nm FinFET technology
(Monday, January 8, 2024)
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DisplayPort v1.4 Tx PHY and Controller IP Cores which is Silicon proven in 12nm technology and also production proven is available for Worldwide instant licensing
(Sunday, January 7, 2024)
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