Design Platform News
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Cadence and Autodesk Collaborate on Smart Product Design
(Sunday, November 12, 2023)
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Accellera Announces IEEE 1666™-2023 Standard Available Through IEEE GET Program
(Wednesday, November 8, 2023)
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Infineon Extends Microcontroller Portfolio with New PSoC Edge Family of Products
(Monday, November 6, 2023)
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SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process
(Sunday, November 5, 2023)
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OPENEDGES Proud to Announce the World's Only 7nm LPDDR5X PHY IP Operating at 8533 Mbps
(Sunday, November 5, 2023)
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proteanTecs Enhances Astera Labs' Connectivity Solutions with Performance and Reliability Monitoring
(Wednesday, November 1, 2023)
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sureCore and Intrinsic announce collaboration to accelerate time to market for innovative ReRAM technology
(Tuesday, October 31, 2023)
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Synopsys Delivers Seamless Interoperability for Semiconductor Design Ecosystem with New Synopsys Cloud OpenLink Program
(Monday, October 30, 2023)
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Realtek Deploys Cadence Tempus Timing Solution to Deliver Working Silicon on N12 Design
(Monday, October 30, 2023)
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Weebit Nano's ReRAM IP Awarded "Embedded Solution Product of the Year" in the Electronic Industry Awards
(Wednesday, October 25, 2023)
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PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
(Monday, October 23, 2023)
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PCI-SIG® Announces Authorized Test Labs Now Available for PCI Express® Technology
(Monday, October 23, 2023)
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Orthogone Technologies Unveils FPGA-Based Lightning-Fast PCIe DMA Controller Solution
(Thursday, October 19, 2023)
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Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry
(Wednesday, October 18, 2023)
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SEMIFIVE Signs MOU with TeraPixel Technologies to Collaborate on Semiconductor Design
(Wednesday, October 18, 2023)
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Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design
(Tuesday, October 17, 2023)
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Arm and Synopsys Strengthen Partnership to Accelerate Custom Silicon on Advanced Nodes
(Tuesday, October 17, 2023)
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Harnessing the power of the ecosystem in the era of custom silicon on Arm
(Tuesday, October 17, 2023)
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Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs
(Tuesday, October 17, 2023)
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ARM edges closer to full 2nm chip designs with Total Design
(Tuesday, October 17, 2023)
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GOWIN Semiconductor Expands its GW1NZ Series of Low-Cost, Small-Size, and Low-Power Devices
(Sunday, October 15, 2023)
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OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP
(Sunday, October 15, 2023)
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Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
(Wednesday, October 11, 2023)
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JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
(Tuesday, October 10, 2023)
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Accellera Releases Portable Test and Stimulus Standard 2.1
(Monday, October 9, 2023)
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Siemens launches Tessent tool for Verilog and RTL design for test
(Monday, October 9, 2023)
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TSMC looks to standardise chiplet protocols in "world changing" move
(Sunday, October 8, 2023)
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ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
(Thursday, October 5, 2023)
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Marquee Semiconductor Joins Singapore Semiconductor Industry Association to Catalyze Development of Singaporean Hub
(Wednesday, October 4, 2023)
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ELES and proteanTecs Partner to Enhance Reliability Testing with Deep Data Analytics
(Wednesday, October 4, 2023)
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Tenstorrent Selects Samsung Foundry to Manufacture Next-Generation AI Chiplet
(Wednesday, October 4, 2023)
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MachineWare announces new ARM processor simulation and SystemC profiling products, adds Windows support
(Wednesday, October 4, 2023)
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TSMC's 3Dblox 2.0 and 3DFabric Alliance Achievements Set the Stage for the Future of 3D IC
(Tuesday, October 3, 2023)
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CEA and Siemens collaborate on research to expand applications of Digital Twin for industry
(Monday, October 2, 2023)
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GlobalFoundries and Microchip Announce Microchip's 28nm SuperFlash® Embedded Flash Memory Solution in Production
(Tuesday, September 26, 2023)
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Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies
(Monday, September 25, 2023)
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Flex Logix Expands Upon Industry-leading Embedded FPGA Customer Base
(Sunday, September 24, 2023)
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Alphacore Recognized for its TID Results of 22-nm FDSOI SRAM Published in IEEE Transactions on Nuclear Science journal
(Wednesday, September 20, 2023)
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UXL looks to standardise heterogeneous compute
(Tuesday, September 19, 2023)
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Flex Logix Announces Reconfigurable Block RAM with ECC Option
(Sunday, September 17, 2023)
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Marquee Semiconductor Achieves ISO 9001 Certification for Exemplary Management System
(Tuesday, September 12, 2023)
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Alchip Collaborates With Arteris To Expand ASIC Design Services
(Tuesday, September 12, 2023)
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VisualSim Secure Model Protector enables companies to collaborate in new product development
(Tuesday, September 5, 2023)
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Toshiba sample software package expands microcontroller development tools ecosystem
(Monday, September 4, 2023)
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Nextera-Adeas ST 2110 IP cores are now available on Intel FPGAs
(Thursday, August 31, 2023)
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Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows
(Wednesday, August 30, 2023)
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Cadence Collaborates with Arm to Accelerate Neoverse V2 Data Center Design Success with Cadence AI-driven Flows
(Tuesday, August 29, 2023)
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QuickLogic Unveils Customizable eFPGA IP on GlobalFoundries' 12LP Process
(Monday, August 28, 2023)
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Racyics becomes Arm Approved Design Partner
(Sunday, August 27, 2023)
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GDDR Does Math, Big-Screen Explosions
(Wednesday, August 23, 2023)
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