Design Platform News
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Defacto part of Arms Partner Catalog
(Tuesday, April 2, 2024)
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Intel and Synopsys Reveal First Heterogeneous Chiplet Design Based on UCIe Does This Chip Hold the Future of the Semiconductor Industry?
(Tuesday, April 2, 2024)
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Microsoft-Funded Quantum Startup Plants Flags in Europe
(Monday, April 1, 2024)
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New fabrication process, a major advance towards quantum computing
(Tuesday, March 26, 2024)
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Bright minds wanted for chip design in Europe
(Tuesday, March 26, 2024)
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Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
(Monday, March 25, 2024)
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Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solution
(Monday, March 25, 2024)
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Samsung Demonstrates New CXL Capabilities and Introduces New Memory Module for Scalable, Composable Disaggregated Infrastructure at Memcon 2024
(Monday, March 25, 2024)
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CoreHW, in Partnership with Unikie, Introduces a Novel RTLS Technology that Significantly Enhances Power Efficiency and Positioning Accuracy
(Sunday, March 24, 2024)
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Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
(Monday, March 18, 2024)
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HCLTech and CAST expand partnership for custom chips
(Monday, March 18, 2024)
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Synopsys Strengthens Polaris Software Integrity Platform with New Dynamic Security Testing Capabilities
(Monday, March 18, 2024)
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A System On Module (SoM) developed by Electra IC: BitFlex-SPB-A7 FPGA SoM
(Sunday, March 17, 2024)
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Weebit Nano to demo its ReRAM technology on GlobalFoundries' 22FDX® platform
(Sunday, March 17, 2024)
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Revolutionary Cadence Reality Digital Twin Platform to Transform Data Center Design for the AI Era
(Sunday, March 17, 2024)
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PrimisAI Unveils Premium Version of RapidGPT, Redefining Hardware Engineering
(Wednesday, March 13, 2024)
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Arasan proudly releases its Radiation Hardened NAND Flash IP
(Tuesday, March 12, 2024)
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HBM3 Initially Exclusively Supplied by SK Hynix, Samsung Rallies Fast After AMD Validation, Says TrendForce
(Tuesday, March 12, 2024)
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Agile Analog delivers first full always-on IP subsystem
(Monday, March 11, 2024)
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Cold Spin-Electronics for Quantum Technologies
(Monday, March 11, 2024)
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Pasqal aims for 10,000 qbit quantum computer in 2026
(Monday, March 11, 2024)
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OPENEDGES and SEMIFIVE Partnership Reinforce the SoC Platform
(Sunday, March 10, 2024)
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Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
(Sunday, March 10, 2024)
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CAST Adds I3C Secondary Controller Core to MIPI IP Product Line
(Thursday, March 7, 2024)
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SignatureIP announces PCIe Gen 6 Controller IP
(Wednesday, March 6, 2024)
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Marvell Announces Industry's First 2nm Platform for Accelerated Infrastructure Silicon
(Wednesday, March 6, 2024)
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nepes corporation expands IC packaging capabilities for the 3D-IC era with advanced design flows from Siemens
(Wednesday, March 6, 2024)
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JEDEC Publishes GDDR7 Graphics Memory Standard
(Tuesday, March 5, 2024)
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The promise of OTS-only memories for next-gen compute
(Monday, March 4, 2024)
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Agile Analog's Christelle Faucon: "Diversity and Equality Are Critical"
(Sunday, March 3, 2024)
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Interview: Mahesh Tirupattur, executive VP of Analog Bits - "Be Passionate, Fail Fast and Recover Quick"
(Sunday, March 3, 2024)
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Unleash Next-Gen Speeds with Silicon-Proven USB 3.0 PHY IP Cores with Type-C Support in Multiple Process Nodes
(Sunday, March 3, 2024)
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Agnisys to Showcase Expertise at DVCon US with Exclusive Short Workshop and Tutorial Sessions
(Sunday, March 3, 2024)
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Accellera Approves Verilog-AMS 2023 Standard for Release
(Sunday, March 3, 2024)
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Sondrel announces two new design contract wins plus two existing Design Consultancy contracts extended
(Thursday, February 29, 2024)
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ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC
(Thursday, February 29, 2024)
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Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips
(Wednesday, February 28, 2024)
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LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP
(Monday, February 26, 2024)
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Bright minds wanted for chip design in Europe
(Monday, February 26, 2024)
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M31 Powers Intel's IFS Alliance to Promote Advanced SoC Development and Innovation
(Sunday, February 25, 2024)
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Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs
(Sunday, February 25, 2024)
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Quantum Computing Insights: Exploring the Latest Breakthroughs
(Sunday, February 25, 2024)
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Weebit Nano demonstrates performance of its ReRAM under extended automotive conditions
(Wednesday, February 21, 2024)
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M31 Promotes Advanced SoC Development and Innovation at Intel Foundry's Direct Connect Event
(Wednesday, February 21, 2024)
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Arm Updates CSS Designs for Hyperscalers' Custom Chips
(Wednesday, February 21, 2024)
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Analog Bits Expands Engineering Presence by Opening a Design Center in Europe
(Tuesday, February 20, 2024)
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Siemens' breakthrough Veloce CS transforms emulation and prototyping with three novel products
(Tuesday, February 20, 2024)
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Taiwan's 5-Bit Superconducting Quantum Computer Goes Online
(Tuesday, February 20, 2024)
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Vervesemi launches Made-in-India semiconductor ASIC
(Tuesday, February 20, 2024)
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IAR unveils Functional Safety version of IAR Embedded Workbench for Arm equipped with certified static analysis capabilities
(Monday, February 19, 2024)
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