Design Platform News
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OPENEDGES Achieves ISO9001: 2015 Certification, Proving IP Quality for its Customers
(Sunday, January 7, 2024)
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Creonic GmbH Joins the Science and Innovation Alliance Kaiserslautern
(Sunday, January 7, 2024)
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Comcores JESD204D IP core confirming to the Revision D of the JESD204 standard released in Dec'2023 now available
(Sunday, January 7, 2024)
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Faraday Collaborates in Arm Total Design to Provide Arm Neoverse CSS-based Design Services
(Wednesday, January 3, 2024)
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M31 Successfully Validates 12nm USB4 PHY IP Empowering Next-Generation High-Speed Data Transmission
(Tuesday, January 2, 2024)
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Accelerate Innovation: Harnessing the Speed of Tomorrow with PCIe Gen 4 PHY and Controller IP Cores
(Monday, January 1, 2024)
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ELECTRA IC Marks a Decade of Design and Verification Excellence at CES 2024
(Monday, January 1, 2024)
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Ventana Microsystems Drives India's Chiplet Innovation in 2024
(Monday, January 1, 2024)
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Ventana Microsystems Drives India's Chiplet Innovation in 2024
(Monday, January 1, 2024)
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PCIe 6.0 moves closer to arriving in the market in 2024: Alphawave demonstrates interoperability
(Thursday, December 28, 2023)
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U.K. Conference Accelerates Post-Quantum Cryptography Standards Review Process
(Thursday, December 28, 2023)
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Rambus Advances Data Center Server Performance with Industry-First Gen4 DDR5 RCD
(Wednesday, December 27, 2023)
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Europe Aims for Leadership Role in Quantum Computing
(Monday, December 25, 2023)
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Quantum predictions for 2024
(Wednesday, December 20, 2023)
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Siemens collaborates with sureCore and Semiwise to pioneer quantum computing ready cryogenic semiconductor designs
(Tuesday, December 19, 2023)
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World's first UCIe heterogeneous chiplet test chip
(Sunday, December 17, 2023)
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Alphawave Semi Partners with Keysight to Deliver Industry Leading Expertise and Interoperability for a Complete PCIe 6.0 Subsystem Solution
(Thursday, December 14, 2023)
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Imec's extremely scaled SOT-MRAM devices show record low switching energy and virtually unlimited endurance
(Wednesday, December 13, 2023)
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QC Design announces launch of fault-tolerance design automation tool Plaquette+ and first sale to QuiX Quantum
(Wednesday, December 13, 2023)
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Alchip Unveils AI 3DIC Design and IP Platform
(Tuesday, December 12, 2023)
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Maximize uptime, capacity utilization, and energy efficiency with always-ready CFD models and data center digital twin technology
(Tuesday, December 12, 2023)
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Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
(Monday, December 11, 2023)
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12-bit 2GS/s high-speed ADC IP Core with Seamless Integration, Ultimate Precision is ready for Immediate Licensing
(Sunday, December 10, 2023)
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EnSilica enters strategic partners with design and custom module developer IndesmaTech
(Sunday, December 10, 2023)
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Layer transfer tech comes to high volume chiplet, 2nm manufacturing
(Thursday, December 7, 2023)
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Siemens' new Calibre DesignEnhancer boosts Samsung Foundry design quality and speeds time to market
(Wednesday, December 6, 2023)
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Ceva Wins Product of the Year Award at Prestigious EE Awards Asia Event
(Wednesday, December 6, 2023)
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Agile Analog partners with sureCore on CryoCMOS Innovate UK project
(Monday, December 4, 2023)
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Tenstorrent Strengthens Presence in Asia with Rapidus Partnership
(Monday, December 4, 2023)
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Applied Materials and CEA-Leti Unveil Joint Lab For Rapidly Growing Specialty Chip Markets
(Monday, December 4, 2023)
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ADTechnology is accelerating its performance and targeting infrastructure markets by joining Arm Total Design.
(Sunday, December 3, 2023)
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Quantum effect technology breakthrough in analogue circuit design
(Sunday, December 3, 2023)
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Cadence Signoff Solutions Empower Samsung Foundry's Breakthrough Success on 5G Networking SoC Design
(Wednesday, November 29, 2023)
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Quantum Effect Technology Breakthrough in Analog Circuit Design
(Tuesday, November 28, 2023)
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Manufacturers Anticipate Completion of NVIDIA's HBM3e Verification by 1Q24; HBM4 Expected to Launch in 2026, Says TrendForce
(Tuesday, November 28, 2023)
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M31 Completes Validation of 7nm ONFI 5.1 I/O IP - Targeting for the Global AI Big Data Storage Market
(Tuesday, November 28, 2023)
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Omni Design Technologies Announces Expanded Silicon IP Solutions on Multiple TSMC Processes
(Tuesday, November 28, 2023)
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Production Proven USB 3.2 Gen1/Gen2 IP Cores to ensure a seamless throughput for Next-Gen SoCs available for Immediate licensing
(Monday, November 27, 2023)
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Bridging the Talent Gap in Flanders' Semiconductor Industry
(Monday, November 27, 2023)
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Siemens revolutionizes engineering simulation with HEEDS AI Simulation Predictor and Simcenter Reduced Order Modeling
(Monday, November 27, 2023)
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Tenstorrent Gains Momentum in Asia With Rapidus Partnership
(Sunday, November 26, 2023)
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LeWiz Open Source LVDS Transceiver Design
(Wednesday, November 22, 2023)
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BrainChip Announces Dr. Tony Lewis as the New Chief Technology Officer
(Wednesday, November 22, 2023)
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Alchip Unveils Industry's First Automotive ASIC Design Platform
(Tuesday, November 21, 2023)
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Weebit Nano's ReRAM IP achieves high temperature qualification in SkyWater Technology's S130 process
(Sunday, November 19, 2023)
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Thalia's AMALIA (23.4a) qualified on Siemens AFS for increased analog design migration flexibility
(Wednesday, November 15, 2023)
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Faraday Unveils Enhanced Gigabit Ethernet PHY on UMCs 28HPC+ Process
(Wednesday, November 15, 2023)
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Rambus Demonstrates CXL Platform Development Kit at SC23
(Monday, November 13, 2023)
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CXL Consortium Announces Compute Express Link 3.1 Specification Release
(Monday, November 13, 2023)
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Movellus Introduces Aeonic Insight™ Product Line for On-die Telemetry
(Monday, November 13, 2023)
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