Chiplet / Multi-Die News
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Signature IP Corporation Demonstrates Configurable NoC Products at Design & Reuse IP SoC Day
(Wednesday, April 26, 2023)
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Alphawave Semi Showcases 3nm Connectivity Solutions and Chiplet-Enabled Platforms for High Performance Data Center Applications
(Tuesday, April 25, 2023)
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Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems
(Sunday, April 23, 2023)
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The Future of Semi Innovation from Disruptive Memory to Chiplets with Alphawave Semi
(Sunday, April 2, 2023)
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Blue Ocean Smart System Unveils Chiplet-Based Products Powered by VeriSilicon's High-Performance Processors
(Wednesday, March 29, 2023)
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Tachyum To Use UCIe Interconnect Standards In Prodigy 2
(Tuesday, March 28, 2023)
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Arteris Unveils Next-Generation FlexNoC 5 Physically Aware Network-on-Chip IP
(Tuesday, February 21, 2023)
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Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
(Wednesday, February 8, 2023)
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Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance
(Wednesday, February 1, 2023)
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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
(Tuesday, January 31, 2023)
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Chiplet Pioneer Eliyan Joins UCIe and JEDEC Industry Standardization Organizations, Expands Veteran Leadership Team to Accelerate Adoption of Breakthrough Die-to-Die Interconnect Solution
(Monday, January 30, 2023)
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All the PCIe 5.0 SSDs Coming Out in the Next Year or So
(Sunday, January 8, 2023)
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SNIA Spec Gets Data Moving in CXL Environment
(Wednesday, January 4, 2023)
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PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors
(Tuesday, December 20, 2022)
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Are You Ready for PCIe 6.0?
(Wednesday, November 16, 2022)
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Alphawave IP Receives 2022 TSMC OIP Partner of the Year Award for High-Speed SerDes IP Innovations
(Tuesday, November 8, 2022)
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Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development
(Tuesday, November 1, 2022)
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GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring
(Wednesday, October 26, 2022)
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Synopsys Collaborates with TSMC to Unleash System Innovation with Most Comprehensive Multi-Die Design Solutions for TSMC's Advanced Technologies
(Wednesday, October 26, 2022)
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GUC Unveils GLink 2.3LL, The World's Most Powerful D2D Interconnect IP Using 2.5D Technology
(Tuesday, October 25, 2022)
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Siemens Tessent Multi Die Automates 2.5D and 3D Chip DFT
(Tuesday, October 25, 2022)
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Intel plans 3nm chiplet for satellite terminal
(Monday, October 10, 2022)
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Intel's Road to a Universal Quantum Computer Is Via Chiplets
(Monday, October 10, 2022)
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CEO interview: Alphawave IP's Pialis on chiplets and custom silicon
(Tuesday, September 20, 2022)
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€16m project to secure the chiplet supply chain in Europe
(Monday, September 19, 2022)
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CEO interview: Alphawave IPs Pialis on chiplets and custom silicon
(Monday, September 19, 2022)
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proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring
(Sunday, September 18, 2022)
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Intel's new 3D Foveros packaging tech: LEGO-like chiplets for CPUs
(Monday, August 22, 2022)
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Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs
(Monday, July 18, 2022)
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GUC Demonstrate World's First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps
(Wednesday, July 6, 2022)
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Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard
(Wednesday, July 6, 2022)
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Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity
(Monday, June 20, 2022)
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SmartDV Charts Course Toward Chiplets, Joins Universal Chiplet Interconnect Express (UCIe)
(Wednesday, June 15, 2022)
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OpenFive Joins Universal Chiplet Interconnect Express (UCIe) Consortium
(Wednesday, June 15, 2022)
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Avery Design Systems Announces Verification Support for New UCIe standard, Accelerating Adoption of Chiplet Interconnect Protocol
(Wednesday, June 15, 2022)
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Alphawave IP Announces Availability of Two New Interconnect IP Products in TSMC Advanced Processes
(Sunday, June 12, 2022)
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CEA-Leti & Intel Report Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
(Wednesday, June 1, 2022)
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MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity
(Sunday, May 22, 2022)
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Chiplets Get a Formal Standard with UCIe 1.0
(Sunday, April 10, 2022)
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Chiplets Get a Formal Standard with UCIe 1.0
(Sunday, April 10, 2022)
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VeriSilicon Joins the Universal Chiplet Interconnect Express Industry Consortium
(Sunday, April 3, 2022)
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eTopus Announces PCIe IP Gen 1-6 and 800G Support For 7/6nm With Support For SoC & Chiplet Clients
(Monday, March 28, 2022)
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GUC Announces 2.5D and 3D Multi-Die APT Platform for AI, HPC, Networking ASICs
(Wednesday, March 9, 2022)
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Leaders in Semiconductors, Packaging, IP Suppliers, Foundries, and Cloud Service Providers Join Forces to Standardize Chiplet Ecosystem
(Wednesday, March 2, 2022)
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eTopus Announces Collaborative IP Platform for Rapid and Economical Deployment of Chiplets
(Tuesday, February 1, 2022)
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CEVA Introduces Security IP for Die-to-Die Communication Between Chiplets
(Tuesday, January 25, 2022)
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CXL Consortium Showcases First Public Demonstrations of Compute Express Link Technology at SC21
(Thursday, November 18, 2021)
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Analog Bits to Demonstrates Low Latency PCIe/CXL Gen 5 on Samsung 8nm at SAFE Forum 2021
(Monday, November 15, 2021)
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Heterogeneous Computing Is About Optimizing Resources
(Sunday, November 7, 2021)
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Blue Cheetah Bunch-of-Wires (BoW) Chiplet Interface Solution Targets Rapid Flexibility, Scalability, and Low Overhead
(Thursday, October 28, 2021)
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