Chiplet / Multi-Die News
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Rebellions Builds Chiplet Roadmap, Merges with Sapeon
(Wednesday, October 16, 2024)
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ADTechnology Partners with Arm, Samsung Foundry, and Rebellions on AI CPU Chiplet Platform
(Tuesday, October 15, 2024)
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Bosch, Tenstorrent to collaborate on standardizing automotive chips
(Wednesday, October 9, 2024)
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Why Chiplets Are the Next Big Innovation in Silicon
(Wednesday, October 9, 2024)
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Chiplet Summit 2024 Shows How Advanced Packaging Keeps Moore's Law Alive
(Tuesday, September 17, 2024)
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Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
(Monday, September 9, 2024)
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Synopsys Powers World's Fastest UCIe-Based Multi-Die Designs with New IP Operating at 40 Gbps
(Monday, September 9, 2024)
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Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design
(Monday, September 2, 2024)
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Intel and Cadence Collaborate to Advance the All-Important UCIe Standard
(Sunday, September 1, 2024)
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YorChip predicts 2026 will be the year of the chiplet
(Tuesday, July 2, 2024)
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Siemens delivers a major leap toward mainstream 3D-IC adoption with new Calibre 3DThermal
(Monday, June 24, 2024)
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Synopsys Accelerates Chip Innovation with Production-Ready Multi-Die Reference Flow for Intel Foundry
(Monday, June 24, 2024)
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Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
(Monday, June 24, 2024)
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Baya Systems and Blue Cheetah Partner to Deliver Chiplet Interconnect Solutions
(Sunday, June 23, 2024)
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Baya Systems Introduces New Technology to Transform SoCs and Chiplets for Emerging Applications
(Thursday, June 20, 2024)
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System-level UCIe IP for early architecture analysis of 3D Chiplet Design and Packaging
(Wednesday, June 19, 2024)
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Alphawave Semi Unlocks 1.2 TBps Connectivity for High-Performance Compute and AI Infrastructure with 9.2 Gbps HBM3E Subsystem
(Wednesday, June 19, 2024)
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Alphawave Reveals Multiprotocol I/O Chiplet Tapeout, Collabs with Arm, Samsung
(Tuesday, June 18, 2024)
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Alphawave Semi Tapes Out Industry-First, Multi-Protocol I/O Connectivity Chiplet for High-Performance Compute and AI Infrastructure
(Wednesday, June 12, 2024)
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SEMIFIVE Collaborates with OPENEDGES on Chiplet Development
(Tuesday, June 11, 2024)
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Introducing USB 3.0, PCIe 2.0 and SATA 3.0 Combo PHY IP Cores to empower Next Gen Connectivity Chipsets
(Sunday, June 9, 2024)
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Alphawave Semi Collaborates with Arm on High-Performance Compute Chiplet
(Wednesday, June 5, 2024)
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GUC provides 3DIC ASIC total service package to AI/HPC/Networking customers
(Thursday, April 18, 2024)
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Arteris Expands Ncore Cache Coherent Interconnect IP To Accelerate Leading-Edge Electronics Designs
(Tuesday, March 12, 2024)
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Alphawave Semi Demonstrates 3nm Silicon-Proven 24Gbps Universal Chiplet Express (UCIe) Subsystem for High-Performance AI Infrastructure
(Sunday, March 10, 2024)
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Siemens qualifies industry-leading IC design solutions for Intel Foundry processes
(Tuesday, February 20, 2024)
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EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
(Monday, February 12, 2024)
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SignatureIP launches its new iNoCulator NoC configuration tool with a free trial offer
(Thursday, February 1, 2024)
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Ansys Semiconductor Simulation Solutions Certified for UMC's 3D Chip Technology
(Wednesday, October 18, 2023)
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Socionext Announces Collaboration with Arm and TSMC on 2nm Multi-Core Leading CPU Chiplet Development
(Tuesday, October 17, 2023)
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Rambus Completes Sale of PHY IP Assets to Cadence
(Wednesday, September 6, 2023)
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GUC Announced 5nm HBM3 PHY and Controller Silicon Proven at 8.4 Gbps
(Tuesday, September 5, 2023)
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QuickLogic and YorChip Partner to Develop Low-Power, Low-Cost UCIe FPGA Chiplets
(Sunday, August 27, 2023)
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Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
(Sunday, August 27, 2023)
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Eliyan Applauds Release of OCP's Latest Multi-die Open Interconnect Standard, BoW 2.0
(Tuesday, August 15, 2023)
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Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year
(Monday, August 14, 2023)
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YorChip launches UniPHY™️ - the first dual-use PHY for Chiplets
(Monday, July 24, 2023)
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Alphawave Semi Spearheads Chiplet-Based Custom Silicon for Generative AI and Data Center Workloads with Successful 3nm Tapeouts of HBM3 and UCIe IP
(Sunday, July 9, 2023)
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Lightelligence Revolutionizes Big Data Interconnect with World's First Optical Network-on-Chip Processor
(Wednesday, June 28, 2023)
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Synopsys and Samsung Foundry Deepen Collaboration to Accelerate Multi-Die System Design for Advanced Samsung Processes
(Tuesday, June 27, 2023)
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YorChip and Siloxit Collaborate on Industry's First Secure Data Acquisition Chiplet for Mass Markets
(Monday, June 26, 2023)
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Creonic Releases Ultrafast BCH Decoder IP Core, Processing One Codeword per Clock Cycle
(Thursday, June 15, 2023)
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Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security
(Monday, June 12, 2023)
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Are Chiplets Enough to Save Moore's Law?
(Sunday, June 4, 2023)
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Tenstorrent Partners with LG to Build AI and RISC-V Chiplets for Smart TVs of the Future
(Tuesday, May 30, 2023)
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Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era
(Tuesday, May 30, 2023)
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Blue Cheetah Demonstrates Industry Leading Silicon-Proven Die-to-Die Interconnect Solution for Chiplets
(Tuesday, May 23, 2023)
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Chiplet interconnect handles 40 Gbps/bump
(Monday, May 22, 2023)
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proteanTecs' Die-to Die Interconnect Monitoring IP Passes TSMC9000 Pre-Silicon Assessment
(Wednesday, May 17, 2023)
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Tenstorrent Selects Arteris IP for AI High-Performance Computing and Datacenter RISC-V Chiplets
(Monday, May 1, 2023)
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