FDSOI News
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Video Interview: Progress on FAMES Pilot Line for 10-nm and 7-nm FD-SOI
(Monday, December 30, 2024)
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CEA-Leti Demonstrates Embedded FeRAM Platform Compatible with 22nm FD-SOI Node
(Tuesday, December 10, 2024)
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Quobly announces key milestone for fault-tolerant quantum computing
(Tuesday, December 10, 2024)
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All systems go for 7nm FDSOI
(Wednesday, June 26, 2024)
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CEA-Leti Reports Breakthrough 3D Sequential Integration (3DSI) Of CMOS Over CMOS with Advanced Metal Lines
(Thursday, December 14, 2023)
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Weebit Nano receives wafers manufactured in GlobalFoundries' 22FDX® process
(Monday, November 20, 2023)
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Scale FD-SOI to 7nm? Yes, We Can
(Wednesday, November 15, 2023)
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CEA-Leti unveils breakthroughs in 3D, RF, power, and quantum computing
(Sunday, November 12, 2023)
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Quantum tunneling avoids thermal noise in analog circuits
(Monday, October 30, 2023)
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China's FD-SOI ecosystem needs more engagement to work as a leapfrogging strategy
(Tuesday, October 24, 2023)
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QuickLogic Announces New eFPGA Contract Targeting GlobalFoundries 22FDX® Platform
(Monday, September 25, 2023)
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BorgWarner To Integrate STMicroelectronics Silicon-Carbide Technology
(Wednesday, August 30, 2023)
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TOSHIBA RELEASES 3RD GENERATION SILICON CARBIDE MOSFETS WITH REDUCED SWITCHING LOSSES
(Wednesday, August 30, 2023)
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BOSCH STARTS PRODUCTION OF 800-VOLT SIC TECHNOLOGY FOR ELECTRIC VEHICLES
(Tuesday, August 29, 2023)
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REALIZING TIGHT-BINDING HAMILTONIANS USING SITE-CONTROLLED COUPLED CAVITY ARRAYS
(Monday, August 28, 2023)
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Leti details move to 10nm, 7nm FD-SOI process in Europe
(Tuesday, June 27, 2023)
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Nordic Reveals "Revolution" of Wireless SoC Line: The nRF54 Series
(Monday, April 17, 2023)
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Nordic Semi introduces fourth generation of multiprotocol SoCs
(Tuesday, April 11, 2023)
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GF to commercialize AR glasses MicroLED solution with FD-SOI technology
(Wednesday, March 8, 2023)
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Understanding conditions for the single electron regime in 28 nm FD-SOI quantum dots: Interpretation of experimental data with 3D quantum TCAD simulations
(Monday, March 6, 2023)
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Vitruvius+: An Area-Efficient RISC-V Decoupled Vector Coprocessor for High Performance Computing Applications
(Tuesday, February 28, 2023)
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Investigation of Anomalous Degradation Tendency of Low-Frequency Noise in Irradiated SOI-NMOSFETs
(Tuesday, February 28, 2023)
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Area-efficient radiation-hardened 6 T SOI SRAM cell design using TDBC Transistors
(Tuesday, February 28, 2023)
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Infineon begins construction of new plant in Dresden
(Thursday, February 16, 2023)
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Single-Event Transient Study of 28 nm UTBB-FDSOI Technology Using Pulsed Laser Mapping
(Wednesday, February 1, 2023)
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CEA & Partners Present 'Powerful Step Towards Industrialization' Of Linear Si Quantum Dot Arrays Using FDSOI Material at VLSI Symposium
(Sunday, September 11, 2022)
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STMicroelectronics Supports the World Transitions to Digitalization and Decarbonization with its Pioneered FD-SOI Technology
(Wednesday, August 3, 2022)
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Open source chip programme expands to 90nm FDSOI
(Sunday, July 31, 2022)
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STMicroelectronics and GlobalFoundries agreed to build a steel factory in France for production of chips on 300-mm FDSOI substrates
(Friday, July 22, 2022)
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From FinFETs to CFETs: imec's Plan for Continued Transistor Scaling
(Friday, July 15, 2022)
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Soitec boosts customer yield of Silicon Carbide semiconductor manufacturing with KLA inspection technology
(Tuesday, July 12, 2022)
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Is It Finally Time for Silicon Photonics to Shine?
(Tuesday, July 12, 2022)
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US Government funding enables SkyWater to further develop IP for its 90 nm rad-hard FDSOI platform to be used in strategic defense and space applications
(Monday, July 11, 2022)
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ST looks at joint European wafer fab with GlobalFoundries
(Tuesday, June 14, 2022)
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SkyWater adds FDSOI SRAM IP
(Thursday, June 9, 2022)
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Soitec reports full year results of fiscal year 2022
(Wednesday, June 8, 2022)
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MediaTek Enters 5G mmWave Market
(Sunday, May 22, 2022)
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CoreHW Announces mmWave GF 22FDX PLL IP
(Tuesday, May 3, 2022)
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Mobile Semiconductor's 22FDX Register File Memory Compiler Receives Globalfoundries Platinum Status
(Wednesday, April 20, 2022)
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QuickLogic Adds GlobalFoundries 22FDX Process to its Growing List of Australis IP Generator-Based eFPGA IP
(Wednesday, April 13, 2022)
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Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications
(Thursday, April 7, 2022)
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Cadence Collaborates with GlobalFoundries to Deliver Complete Digital Solution on Amazon Web Services
(Wednesday, March 23, 2022)
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MICLEDI Microdisplays Announces Agreement with GlobalFoundries to Collaborate on MicroLED Displays for AR Glasses
(Monday, March 21, 2022)
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Weebit scaling down its ReRAM technology to 22nm
(Monday, March 14, 2022)
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Grenoble INP - Phelma, UGA and Soitec sign their first partnership agreement
(Sunday, March 13, 2022)
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Soitec Board Announces CEO Succession Plan - Pierre Barnabe To Succeed Ceo Paul Boudre At The Close Of The July 2022 Shareholders Meeting
(Tuesday, January 18, 2022)
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Phase-change memory comes to 18nm FDSOI
(Tuesday, December 14, 2021)
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10/100/1000M Ethernet PHY IP Core in ST 28FDSOI technology licensed to a leading Chinese Semiconductor company for Broadband Access Networks Application
(Sunday, December 12, 2021)
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Weebit demonstrates successful scaling of its ReRAM technology to 28nm
(Sunday, October 3, 2021)
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Weebit scale ReRAM to 28nm
(Sunday, October 3, 2021)
