Design Platform News
-
VLAB Works enables Embedded Applications with VLAB VDMs
(Sunday, May 1, 2022)
-
GbE (10/100/1000Base-T) PHY IP Cores with matching 1G Ethernet MAC, PCS and TSN MAC Controller IP Cores for all your high-speed Ethernet Networking applications is available for immediate licensing
(Sunday, May 1, 2022)
-
Arasan Announces its eMMC 5.1 Total IP Solution for 5nm SoC Designs
(Wednesday, April 27, 2022)
-
(R)evolution in I3C?
(Wednesday, April 27, 2022)
-
16G Multiprotocol Serdes IP Core with different Interface protocols for your High-Speed interconnect requirements in 28HPC+ process technology is available for immediate licensing
(Sunday, April 24, 2022)
-
JESD204B Tx & Rx SerDes IP Core (12.5Gbps & 16Gbps) in 28HPC+ and 40LL process technologies for High-Speed Serial Interface with Matching Controller IP Core is available for immediate licensing
(Monday, April 18, 2022)
-
MOSCHIP Announces High Speed Serial Trace Probe (HSSTP) PHY With Link Layer in 6nm
(Sunday, April 17, 2022)
-
Synopsys Study Highlights Challenges with Managing Open Source Risk in Software Supply Chains
(Wednesday, April 13, 2022)
-
Renesas Introduces Industry's First PCIe Gen6 Clock Buffers and Multiplexers
(Wednesday, April 13, 2022)
-
SiemensÂ’ New mPower Digital Solution Now Certified for GlobalFoundriesÂ’ Platforms
(Tuesday, April 12, 2022)
-
New Cadence High-Speed Ethernet Controller IP Family Enables Silicon-Proven Ethernet Subsystem Solutions up to 800Gbps
(Monday, April 11, 2022)
-
Photonic quantum computer made in Germany
(Monday, April 11, 2022)
-
CFX announces commercial availability of anti-fuse OTP technology on 28HV process
(Sunday, April 10, 2022)
-
Cadence Spectre FX FastSPICE Simulator Is Adopted by SK Hynix to Accelerate DRAM Design
(Sunday, April 10, 2022)
-
Sondrel warns that packaging lead time have dramatically increased from 8 to more than 50 weeks
(Wednesday, April 6, 2022)
-
Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase
(Wednesday, April 6, 2022)
-
Sondrel warns that packaging lead times have jumped to more than 50 weeks
(Tuesday, April 5, 2022)
-
MIPI UFS Controller, MIPI Unipro Controller and MIPI M-PHY IP Cores available in different Fabs and Nodes for all High-density Flash Storage applications in advanced SoCs
(Monday, April 4, 2022)
-
New Arm-based cloud services from Microsoft highlight the power of choice in computing
(Monday, April 4, 2022)
-
ARIES Embedded Presents New MCXL Reference IP Design
(Wednesday, March 30, 2022)
-
Faraday Launches Cortex-A53-based Platform to Accelerate FinFET SoC Development
(Wednesday, March 30, 2022)
-
M31 Speeds Delivery of Silicon IP by 5X Using the Cadence Library Characterization Solution in the Cloud
(Wednesday, March 30, 2022)
-
Synopsys Launches Industry's First Broad-Scale Cloud SaaS Solution to Transform Chip Development Landscape
(Tuesday, March 29, 2022)
-
Advancing VHDL's Verification Capabilities with VHDL-2019 Protected Types
(Monday, March 28, 2022)
-
Edgewater Wireless selects CMC Microsystems as fabrication services Partner
(Monday, March 28, 2022)
-
Introducing DDR5/DDR4/LPDDR5 Combo PHY IP Core, Silicon Proven in 12FFC for Next-Gen High performance SoCs is available for immediate licensing
(Sunday, March 27, 2022)
-
O-RAN Fronthaul Transport Subsystem is now available
(Wednesday, March 23, 2022)
-
CEA and Startup C12 Join Forces to Develop Next-Generation Quantum Computers with Multi-Qubit Chips at Wafer Scale
(Wednesday, March 23, 2022)
-
Cadence Selected by Microsoft for RAMP Phase II Program
(Wednesday, March 23, 2022)
-
Avalanche Technology and Efabless Partner for System-On-Chip Development using Google's Open-Source Program
(Monday, March 21, 2022)
-
Intrinsic ID Optimizes SRAM PUF Security Technology for Advanced Process Nodes with QuiddiKey 4.x
(Wednesday, March 16, 2022)
-
Xylon Demonstrates Hot Swapping of Programmable FPGA/SoC Chip Parts
(Wednesday, March 16, 2022)
-
Synopsys Improves Interoperability Between CODE V and LightTools
(Monday, March 14, 2022)
-
OPENEDGES Announces Silicon Proven 12nm LPDDR54 PHY IP
(Wednesday, March 9, 2022)
-
Zepp Health signs licence agreement for sureCore's EverOn ultra-low voltage memory IP
(Wednesday, March 9, 2022)
-
Arasan announces the immediate availability of its MIPI D-PHY IP as Tx Only or Rx Only for the GlobalFoundries 12nm FinFET process node
(Tuesday, March 8, 2022)
-
PCIe 5.0 SerDes PHY and Controller IP Cores for all High-End Serial connect Interfaces in advanced SoCs is available for immediate licensing
(Sunday, March 6, 2022)
-
Synopsys Extends OptoCompiler Support for New GF Fotonix Platform
(Sunday, March 6, 2022)
-
Agile Analog's Approach to Analog IP Design and Quality — Why "Silicon Proven" is NOT What You Think
(Thursday, March 3, 2022)
-
Dolphin Design chooses DEFACTO's SoC Compiler 9.0: a turnkey methodology to reduce project costs and increase team efficiency
(Wednesday, March 2, 2022)
-
Sondrel explains the 10 steps to model and design a complex SoC
(Tuesday, March 1, 2022)
-
USB 3.1 Device & Host Controller IP Cores with highly configurable design for Superspeed data transfers in all kinds of advanced SoCs is available for immediate licensing
(Sunday, February 27, 2022)
-
Cadence and Dassault Systemes Partner to Transform Electronic Systems Development
(Wednesday, February 23, 2022)
-
We are now AS 9100D certified! - Logic Fruit Technologies
(Sunday, February 20, 2022)
-
MIPI D-PHY Tx IP Core in 22nm along with MIPI DSI-2 Tx Controller IP Core for your High-End Camera and Display needs is available for immediate licensing
(Sunday, February 20, 2022)
-
Faraday Succeeds in Factory Automation ASIC
(Wednesday, February 16, 2022)
-
Berkeley Lab Unveils ASIC Chip Failure Bypass System
(Wednesday, February 16, 2022)
-
Synopsys to enable secure software development
(Sunday, February 13, 2022)
-
SMIC Outpaces Rivals on Strong Local Demand
(Saturday, February 12, 2022)
-
Sondrel's IP platforms prevent operational chip errors as Functional Safety is built in
(Tuesday, February 8, 2022)