Design Platform News
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Sondrel extends multi-year, multi-million dollar EDA license with Synopsys
(Monday, March 6, 2023)
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Weebit Nano partners with University of Florida's Nino Research Group to examine effects of radiation on Weebit ReRAM
(Monday, March 6, 2023)
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Weebit Nano ReRAM IP now available in SkyWater Technology's S130 process
(Monday, March 6, 2023)
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Samsung Foundry, Anaflash partner on embedded flash memory
(Monday, March 6, 2023)
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OPENEDGES Announces LPDDR5X/5/4x/4 PHY Tapeout at 7nm process node
(Sunday, March 5, 2023)
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Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions
(Sunday, March 5, 2023)
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Intel expands ecosystem with quantum computing SDK
(Thursday, March 2, 2023)
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Floadia Completes eFlash IP Qualification on TSMC 130BCD plus Process and Achieves the World's Highest Data Retention for 10 Years at 200°C
(Wednesday, March 1, 2023)
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HDL Design House has opened New design center in Nis - Serbia
(Wednesday, March 1, 2023)
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Omni Design Technologies Awarded ISO 9001 Certification
(Tuesday, February 28, 2023)
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Agile Analog announces first customisable, process agnostic, 12-bit ADC IP
(Monday, February 27, 2023)
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Truechip Announces Early Adopter Version of Sub-System Verification IP
(Monday, February 27, 2023)
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MIPI Alliance Welcomes Google as a Promoter Member
(Monday, February 27, 2023)
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Mixel MIPI D-PHY IP Integrated into Teledyne e2v's new Topaz CMOS Image Sensors
(Monday, February 27, 2023)
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Avery Design Debuts CXL Validation Suite
(Monday, February 27, 2023)
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MIPI M-PHY 4.1 IP, UFS 3.1 Controller IP & Unipro 1.8 Controller IP Cores are available for instant licensing to support your total UFS applications
(Sunday, February 26, 2023)
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IC'ALPS announces successful physical implementation of a demo-chip designed for Weebit Nano's ReRAM technology
(Sunday, February 26, 2023)
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India's Chip Designers To Get Access To State-Of-The-Art Tools At Newly Launched ChipIN Centre At C-DAC Bengaluru
(Sunday, February 26, 2023)
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EQUALITY consortium selected by the EU's Horizon Europe Program to develop quantum algorithms for industrial applications
(Wednesday, February 22, 2023)
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Pushing the System-in-Package Concept Into the Future
(Tuesday, February 21, 2023)
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Veriest Solutions to Present Two Verification Papers at DVCon US Conference
(Tuesday, February 21, 2023)
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Non-Volatile Memory: What Will 2023 Bring?
(Monday, February 20, 2023)
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Low power PLL for short-range mmwave industrial radar
(Monday, February 20, 2023)
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Weebit Nano to demonstrate new silicon at Embedded World 2023
(Sunday, February 19, 2023)
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Verification IP for chiplet designs
(Friday, February 17, 2023)
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Industry First PCI Express® 6.0 and CXL Interposer Improves Data Captures for Speeds up to 64 GT/s
(Monday, February 13, 2023)
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The Value of Semiconductor Packaging Technology in the Era of Heterogeneous Integration
(Wednesday, February 8, 2023)
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ShortLink AB joins X-FAB's Design & Supply Chain Partner Network and IP Portal
(Tuesday, February 7, 2023)
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AI-designed Chips Reach Scale with First 100 Commercial Tape-outs Using Synopsys Technology
(Monday, February 6, 2023)
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Peripheral IPs with proven automotive compatibility are instantly licensable for extremely reliable performance.
(Sunday, February 5, 2023)
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DVB-RCS2 Turbo Decoder and Encoder IP Core Available For Integration From Global IP Core
(Sunday, February 5, 2023)
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Rambus ups DDR5 data rate and bandwidth by 33%
(Tuesday, January 31, 2023)
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4 articles CIOs should read about open source in 2023
(Tuesday, January 31, 2023)
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Siemens advances integrated circuit verification with new, data-driven Questa Verification IQ software
(Monday, January 30, 2023)
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Faraday Announces Multi-site Manufacturing Support in ASIC
(Monday, January 30, 2023)
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10-bit 3Msps Ultra low power SAR ADC IP core for Wireless Communication and Automotive SoCs is available for immediate licensing
(Sunday, January 29, 2023)
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BoW Strengthens Pathway to Chiplet Standardization
(Wednesday, January 25, 2023)
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Cadence Quantus FS Solution, a 3D Field Solver, Achieves Certification for Samsung Foundry's SF4, SF3E and SF3 Process Technologies
(Wednesday, January 25, 2023)
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Axiomise Accelerates Formal Verification Adoption Across the Industry
(Wednesday, January 25, 2023)
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Best FPGA (Field-Programmable Gate Arrays) Companies in 2023
(Tuesday, January 24, 2023)
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Avery Design Systems and CoMira Announce Partnership To Enable UCIe-Compliant Chiplet Design
(Tuesday, January 24, 2023)
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Open Compute Project Foundation and JEDEC Announce a New Collaboration
(Tuesday, January 24, 2023)
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OpenLogic by Perforce and the Open Source Initiative Release 2023 State of Open Source Report
(Tuesday, January 24, 2023)
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Semiconductor Companies Create Building Block for Chiplet Design
(Monday, January 23, 2023)
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Startup raises funds to advance neutral atoms quantum computing
(Monday, January 23, 2023)
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AI Compute Company Banks on Chiplets for Future Processors
(Monday, January 23, 2023)
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Accellera Announces the Formation of the Clock Domain Crossing Working Group
(Sunday, January 22, 2023)
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Scaling Up Quantum Computing by Interconnecting Quantum Processors
(Sunday, January 22, 2023)
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Swedish quantum computer boost for industry
(Sunday, January 22, 2023)
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XConn Achieves First-Pass Silicon Success for CXL Switch SoC with Synopsys CXL and PCI Express IP Products
(Wednesday, January 18, 2023)
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