embedded.com, Feb. 20, 2025 –
STMicroelectronics (ST) is advancing its proprietary silicon photonics (SiPho) and BiCMOS technologies to support optical interconnects in data centers and artificial-intelligence clusters. These developments are meant to allow faster and more energy-efficient solutions, given the growing need for AI computation. Starting in the second half of 2025, the technologies supporting 800-Gb/s and 1.6-Tb/s optical modules should drive production.
ST wants to guarantee a consistent supply for optical module providers and hyperscalers by using 300-mm production techniques in Europe, therefore enhancing its position in the data center and AI sectors.
ST's approach focuses on three important areas: high-performance cloud AI architecture, enhancing edge AI computing performance, and providing strong security for the digital environment. AI keeps growing while hyperscale companies try to maximize energy consumption, both per unit of computing power and per bit of data transmitted.
Stressing the need for efficient optical interconnects in modern data centers, Vincent Fraisse, ST's GM for the RF and optical communication subgroup said during a media conference, "We believe in a new era of accelerated AI infrastructure, with all server elements either optically connected or interconnected."...