Other News
-
iPhone X Costs Apple Nearly $370 in Materials, IHS Markit Teardown Reveals
(Tuesday, November 7, 2017)
-
True Circuits Attends the TSMC 2017 China OIP Ecosystem Forum
(Monday, November 6, 2017)
-
True Circuits Signs Five Year PLL License with Tsinghua University in China
(Monday, November 6, 2017)
-
Top 5 increase grip on China phone market 2
(Monday, November 6, 2017)
-
'Historic' AMD Pact Shows Intel's New Reality
(Monday, November 6, 2017)
-
Lattice Semiconductor Reports Third Quarter 2017 Results
(Monday, November 6, 2017)
-
GUC Monthly Sales Report - Oct 2017
(Sunday, November 5, 2017)
-
Semiconductor IPOs Back in Vogue
(Sunday, November 5, 2017)
-
Broadcom Proposes to Acquire Qualcomm for $70.00 per Share in Cash and Stock in Transaction Valued at $130 Billion 1
(Sunday, November 5, 2017)
-
Xilinx Announces Intention to Invest $40M in Expansion of Research, Development, and Engineering Operations at EMEA Headquarters in Ireland
(Thursday, November 2, 2017)
-
Higher DRAM Bit Growth Seen For 2018
(Wednesday, November 1, 2017)
-
Faraday Reports EPS NT$0.50 for Third Quarter 2017 Gross Margin 52.5%, Reaches a 3 Year-High
(Wednesday, November 1, 2017)
-
Xilinx Announces Appointment of Two New Directors
(Wednesday, November 1, 2017)
-
Intrinsic ID Signs Agreement with Open Security Research for China Representation
(Wednesday, November 1, 2017)
-
ArterisIP Expands Worldwide Engineering Centers of Excellence and Talent Roster
(Wednesday, November 1, 2017)
-
Semiconductor Sales Hit $108 Billion in Q3
(Wednesday, November 1, 2017)
-
Apple May Drop Qualcomm Chips
(Wednesday, November 1, 2017)
-
Cadence to Expand High-Speed Communications IP Portfolio with Acquisition of nusemi inc
(Tuesday, October 31, 2017)
-
Moortec to exhibit their embedded In-Chip Monitoring Subsystem IP at the 2017 TSMC China OIP Ecosystem Forum in Shenzhen
(Tuesday, October 31, 2017)
-
Saving Power with Temperature Compensation
(Tuesday, October 31, 2017)
-
Samsung's Chip Sales Hit New High
(Monday, October 30, 2017)
-
X-factors Hobble iPhone X
(Monday, October 30, 2017)
-
Synopsys' DesignWare STAR Memory System's New Test and Repair Capabilities Speed Embedded Memory Repair Time by 10x
(Monday, October 30, 2017)
-
Truechip Announces First Customer Shipment Of USB 3.2 Verification IP
(Monday, October 30, 2017)
-
Global Semiconductor Industry Posts Highest-Ever Quarterly Sales
(Sunday, October 29, 2017)
-
Thoughts on Jem Davies leading Arm's machine learning group
(Sunday, October 29, 2017)
-
STMicro Sees Growth Across the Board
(Thursday, October 26, 2017)
-
Intel Enables 5G, NFV and Data Centers with High-Performance, High-Density Arm-based Intel Stratix 10 FPGA
(Wednesday, October 25, 2017)
-
Arm Unveils New AI Group
(Wednesday, October 25, 2017)
-
Here's Why Taiwan Semiconductor Manufacturing Co. Ltd.'s 16-Nano Shipments Dropped
(Wednesday, October 25, 2017)
-
UPDATE 1-China Everbright, VC firm Walden launch $500 mln semiconductor fund (165)
(Wednesday, October 25, 2017)
-
Bitmain Introduces Its First Hardware for Accelerating Artificial Intelligence (AI) Applications
(Tuesday, October 24, 2017)
-
HEVC Advance Announces Revised Royalty Rates for Lower-Priced Devices
(Monday, October 23, 2017)
-
Apple Talks About Sole Sourcing from TSMC
(Monday, October 23, 2017)
-
PLDA GROUP Announces Divestiture of REFLEX CES, Enabling an Increased Focus on Its Core Activities and Investments in High Potential Business Segments
(Monday, October 23, 2017)
-
UltraSoC appoints Alberto Sangiovanni-Vincentelli as Chairman
(Monday, October 23, 2017)
-
Rambus Reports Third Quarter 2017 Financial Results
(Sunday, October 22, 2017)