Networking News
-
Creonic Expands Satellite IP Core Portfolio with DVB-S2X Multi-Carrier Demodulator
(Monday, September 18, 2023)
-
CEVA Bluetooth® 5.4 IP Achieves SIG Qualification, Includes New Features to Address Rapidly Growing Electronic Shelf Label (ESL) Market
(Tuesday, September 5, 2023)
-
T2M Unveils Top-Selling Gigabit Ethernet PHY IP Core with Unlimited Usage and Full Modification rights, available for licensing immediately
(Sunday, August 27, 2023)
-
Bluetooth Dual Mode v5.3 RF Transceiver IP Cores in 22nm, 40nm, 55nm is Available for Immediate Licensing for TWS, Audio Chipsets and Automotive Applications
(Sunday, August 13, 2023)
-
Creonic Unveils CCSDS 131.2 Wideband Modulator IP Core Achieving 1 GSymb/s
(Wednesday, July 26, 2023)
-
Imec Advances GaN-on-Si and InP-on-Si Technologies for Next-Gen Wireless Communication
(Monday, July 3, 2023)
-
Bluetooth Dual Mode V5.3 RF Transceiver IP Cores in 40nm ULP is Available for Immediate Licensing
(Sunday, July 2, 2023)
-
AccelerComm Announces 5G PUSCH Channel Equalizer
(Sunday, July 2, 2023)
-
Achronix Pushes the Boundaries of Networking with 400 GbE and PCIe Gen 5.0 for SmartNICs
(Monday, June 12, 2023)
-
S2C Accelerates Development Timeline of Bluetooth LE Audio SoC
(Tuesday, June 6, 2023)
-
VeriSilicon Obtained Bluetooth 5.3 Certification for Its Complete Bluetooth Low Energy Solution
(Monday, June 5, 2023)
-
NVIDIA Collaborates With SoftBank Corp. to Power SoftBank's Next-Gen Data Centers Using Grace Hopper Superchip for Generative AI and 5G/6G
(Wednesday, May 31, 2023)
-
Apple Signs Multibillion-Dollar Deal with Broadcom for US-Made 5G RF Components
(Wednesday, May 24, 2023)
-
Silex Technology Announces High-Performance 802.11ah Wi-Fi HaLow SDIO Module
(Tuesday, May 23, 2023)
-
AccelerComm secures £21.5m funding to supercharge 5G radio performance
(Sunday, May 14, 2023)
-
Creonic Introduces 25 Gbit/s LDPC IP Core Solution for ITU G.9804.2 PON Standard
(Tuesday, May 9, 2023)
-
Developing and verifying 5G designs: A unique challenge
(Monday, May 8, 2023)
-
AccelerComm's LEOphy Shortlisted at SCF Industry Awards 2023
(Tuesday, May 2, 2023)
-
UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications
(Tuesday, May 2, 2023)
-
£21.5m raised to supercharge 5G radio performance | AccelerComm
(Sunday, April 30, 2023)
-
LC3plus audio codec for various Audio Application Is Available for Immediate Licensing!!
(Sunday, April 30, 2023)
-
Creonic Introduces FEC IP Core Solution for SDA Free-Space Optical OCT V3.0 Standard
(Wednesday, April 26, 2023)
-
Cadence and TSMC Collaborate on N16 79GHz mmWave Design Reference Flow to Accelerate Radar, 5G and Wireless Innovation
(Monday, April 24, 2023)
-
6G is Happening, and Here's What You Need to Know
(Monday, April 24, 2023)
-
Coherent Logix collaborates with Omni Design, AkiraNET Co. and Socionext to deliver reference design for Wi-Fi 6E/7
(Sunday, April 23, 2023)
-
UK wireless strategy aims to boost 5G/6G deployment
(Monday, April 10, 2023)
-
Synopsys Accelerates First-Pass Silicon Success for Banias Labs' Networking SoC
(Wednesday, April 5, 2023)
-
SoftBank and EdgeCortix Partner to Jointly Realize Low-latency and Highly Energy-efficient 5G Wireless Accelerators
(Tuesday, March 21, 2023)
-
CEVA Wi-Fi 6 IP Powers ESWIN ECR6600 Smart Connectivity IC
(Sunday, March 12, 2023)
-
CEVA to Showcase Latest Wireless Connectivity and Smart Sensing Solutions at embedded world 2023
(Wednesday, March 8, 2023)
-
Capgemini expands its 5G innovation program with new '5G Solutions Center's in San Francisco
(Monday, February 27, 2023)
-
Socionext Introduces New 7nm ADC and DAC for 5G Direct RF Transmitters and Receivers
(Tuesday, February 21, 2023)
-
Qualinx Raises €8 Million to Bring Game-Changing Digital RF Technology to Market
(Monday, February 20, 2023)
-
Accurate Positioning Systems and Proximity Solutions with CoreHW Bluetooth® AoA and AoD Antenna Modules
(Thursday, February 16, 2023)
-
Bluetooth SIG Introduces Wireless Standard for Electronic Shelf Label Market
(Sunday, February 12, 2023)
-
AccelerComm to deliver cell service from space with 5G NTN LEO
(Sunday, February 12, 2023)
-
CEA-Leti: innovation to fuel 6G wireless communications
(Tuesday, January 24, 2023)
-
6G-IA and ETSI to bridge research, standards and industry
(Monday, January 23, 2023)
-
New Wave DV Releases Two New SOSA-Aligned 3U VPX ACAP (FPGA) Modules
(Sunday, January 22, 2023)
-
Comcores TSN technology and 5G communication expertise to be deployed in a significant EU funded project with pan-European partners
(Thursday, January 19, 2023)
-
Automotive-grade module marries Wi-Fi 6E, Bluetooth LE Audio
(Wednesday, January 18, 2023)
-
Stadia's Bluetooth controller tool now live so users can connect to other devices
(Monday, January 16, 2023)
-
Creonic DVB-GSE Encapsulator and Decapsulator IP Cores Are Now Available with Data Rates of up to 4Gbit/s
(Wednesday, January 11, 2023)
-
Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs
(Thursday, January 5, 2023)
-
CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution
(Wednesday, January 4, 2023)
-
6G project aims to connect cars and drones
(Tuesday, December 27, 2022)
-
UK government to invest £110m in 5G and 6G research
(Sunday, December 18, 2022)
-
IEEE802.11n/ac/ax Wi-Fi LDPC Encoder and Decoder FEC IP Core Available For Licensing and Implementation from Global IP Core
(Monday, December 5, 2022)
-
A 6G Tree Grows in Brooklyn?
(Tuesday, November 29, 2022)
-
Cadence and UMC Certified mmWave Reference Flow Delivers First-Pass Silicon Success
(Tuesday, November 29, 2022)