Internet of Things News
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PathPartner Announces PT605 System on Module (SoM) & Smart Camera Reference Design Kit based on Qualcomm® QCS605 SoC
(Tuesday, January 26, 2021)
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Dual Mode Bluetooth v5.2 SW Link Layer, Protocol Stack SW, Profiles licensed for ultra-low power 22nm True Wireless (TWS) Earbuds SoC
(Monday, January 18, 2021)
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Andes Technology and Rafael Microelectronics Announce a Strategic Partnership to Provide High Power Efficiency Wireless IP Solutions for IoT Devices
(Wednesday, January 13, 2021)
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Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed
(Tuesday, January 5, 2021)
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SensiML Introduces Free Community Edition of Analytics Toolkit
(Monday, December 14, 2020)
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IO and multiprotocol processing in highly demanding embedded architectures
(Sunday, November 29, 2020)
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5G and eSIM technologies will help grow industrial IoT connections to 37b by 2025
(Monday, November 23, 2020)
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CEVA's Bluetooth Low Energy 5.2 Platform is First IP to Receive Bluetooth SIG Qualification
(Sunday, November 22, 2020)
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Wi-Fi HaLow Reference Platform Available from Palma Ceia SemiDesign
(Thursday, November 19, 2020)
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Dialog launches partner programme for its open industrial IoT edge server
(Tuesday, November 17, 2020)
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Dialog Semiconductor Introduces SmartServer™ IoT Partner Ecosystem for Edge Solutions in Smart Buildings and Factories
(Monday, November 16, 2020)
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Ultra-low power GNSS Multi-Constellation Digital IP Core licensed to a European Semiconductor company for battery powered IOT & Wearable applications
(Monday, November 16, 2020)
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Nestwave Recognized for IoT Innovation in 2020 Mobile Breakthrough Awards Program
(Wednesday, November 11, 2020)
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SDR RF IP, 100MHz-2.6GHz, for ultra-low power applications from IoT, M2M to 5G available from T2MIP
(Wednesday, October 28, 2020)
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EvoNexus and GLOBALFOUNDRIES Team to Accelerate Growth of Wireless and IoT Startups
(Sunday, October 25, 2020)
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GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution
(Sunday, October 18, 2020)
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Industry's first security microcontrollers for a complete IoT lifecycle management solution
(Wednesday, October 14, 2020)
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CSEM joins forces with GLOBALFOUNDRIES to deliver best-in-class Bluetooth Dual-Mode silicon IP for next generation portable audio
(Wednesday, October 14, 2020)
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Everactive Adopts Movellus Sub-Microwatt Clocking Solution for its Batteryless IIoT System
(Tuesday, October 6, 2020)
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Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications
(Monday, October 5, 2020)
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Chipus Annouces new power management IP for hearables and wearables
(Wednesday, September 23, 2020)
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Vidatronic Launches New 22 nm Analog IP For Ultra-Low-Power, System-On-Chip Physical Attack Mitigation In Internet Of Things (IoT) Applications
(Wednesday, September 23, 2020)
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CEVA Enhances the User Experience and Extends the Use Cases for TWS Earbuds and Hearables with New MotionEngine Hear Sensor Fusion Software
(Monday, September 21, 2020)
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Interview with Nestwave CEO: low power geolocation without positioning chipset
(Thursday, September 17, 2020)
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Xilinx Ships Multi-Function Telco Accelerator Card for Growing 5G O-RAN Virtual Baseband Unit Markets
(Tuesday, September 15, 2020)
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Australia Introduces Code of Practice for IoT Devices
(Tuesday, September 15, 2020)
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SIMCom claims NB-IoT Will Accelerate the Expansion of IoT
(Sunday, September 13, 2020)
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Synopsys and Nestwave Collaborate to Develop a Low-Power Geolocation IP Solution for IoT Modems
(Wednesday, September 2, 2020)
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The biggest IoT mistakes businesses make
(Monday, August 31, 2020)
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Dolphin Design Releases its First Development Platform on TSMC 22ULL Process for Smart Home Applications
(Sunday, August 23, 2020)
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Proof of concept security platform protects IoT and 5G private networks
(Tuesday, August 18, 2020)
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Startup Claims Low-power IoT Geolocation Without a Positioning Chipset
(Wednesday, August 12, 2020)
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Dialog Semiconductor's FusionHD™ NOR Flash Memory Compatible and Qualified with its SmartBond™ Bluetooth Low Energy Wireless MCUs
(Tuesday, August 11, 2020)
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CEVA NB-IoT IP Achieves Monumental Milestone; Awarded Full Certification from Deutsche Telekom
(Tuesday, August 11, 2020)
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Gowin Semiconductor Adds Korea Certification For Their Bluetooth Low Energy Enabled MSoC FPGA Modules
(Tuesday, August 11, 2020)
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Aldec's TySOM Embedded Development Kits are Now Qualified for AWS IoT Greengrass
(Wednesday, August 5, 2020)
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Avanci Launches 5G Licensing Platform for the Internet of Things
(Tuesday, July 28, 2020)
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IoT Growth Demands Rethink of Long-Term Storage Strategies
(Tuesday, July 28, 2020)
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ON Semiconductor Provides BLE Solution with Veridify
(Tuesday, July 28, 2020)
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Long-Range Wireless Power Transfer for Industrial IoT
(Sunday, July 19, 2020)
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Antitrust: the European Commission launches sector inquiry into the consumer Internet of Things (IoT)
(Sunday, July 19, 2020)
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Long-Range Wireless Power Transfer for Industrial IoT
(Sunday, July 19, 2020)
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Nestwave wins Must Award in the category Most Innovative Startup
(Thursday, July 16, 2020)
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Faraday Launches Ariel SoC Platform with Infineon's SONOS eFlash to Drive IoT Development
(Wednesday, July 15, 2020)
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Wi-Fi 6 is Set to Change the Future of IoT–Here's Why
(Tuesday, July 7, 2020)
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Dolphin Design unveils the final piece of their platform offer with BAT, an audio solution for high quality AIoT applications
(Sunday, July 5, 2020)
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OPENEDGES Network-on-Chip Interconnect IP and DDR Controller Licensed for GCT Semiconductor LTE Category 19 Chip
(Tuesday, June 30, 2020)
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T2M announces Industry's first Ultra Low-Power Bluetooth Dual Mode RF IP on TSMC 22nm.
(Tuesday, June 23, 2020)
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AIoT Chip Slashes Power Consumption for Person Detection
(Monday, June 22, 2020)
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Where Innovation Is Happening in Geolocation: Signal Processing
(Wednesday, June 17, 2020)
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