Automotive News
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Automotive Cybersecurity: More Than In-Vehicle and Cloud
(Monday, July 4, 2022)
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Cadence Advances Radar, Lidar and Communications Processing for Automotive, Consumer and Industrial Markets
(Sunday, July 3, 2022)
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New Cadence Xcelium Apps Accelerate Simulation-Based Verification for Automotive, Mobile and Hyperscale Designs
(Wednesday, June 29, 2022)
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EnSilica chassis control ASIC for premium automotive brand enters mass production
(Tuesday, June 28, 2022)
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Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics
(Monday, June 27, 2022)
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CEVA Extends its RivieraWaves UWB IP to Support CCC's Digital Key 3.0 Standard for Keyless Access to Vehicles
(Tuesday, June 21, 2022)
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Fraunhofer IPMS develops CANsec Controller IP-Core CAN-SEC
(Sunday, June 19, 2022)
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Imagination GPU approved by HORIBA MIRA Certification Limited for functionally safe ADAS and HMI applications
(Monday, June 13, 2022)
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Toshiba and Japan Semiconductor Develop Highly Reliable Versatile Analog Platform with Floadia's G1 technology for Automotive Applications
(Wednesday, June 8, 2022)
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The Automotive Industry is driving down acceptable chip defect levels
(Tuesday, June 7, 2022)
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aiMotive ships first aiWare4 NPU production RTL
(Wednesday, June 1, 2022)
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VeriSilicon's Chip Design Process Obtains ISO 26262 Automotive Functional Safety Management System Certification
(Thursday, May 19, 2022)
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Arasan announces its 2'nd Generation of CAN IP
(Thursday, May 19, 2022)
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Creonic GmbH joins NewSpace Initiative
(Monday, May 9, 2022)
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Sondrel Deploys Arteris IP for Next-Generation Multi-Channel Automotive SoC
(Monday, May 2, 2022)
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Renesas equips vehicle computer with optical broadband interface
(Monday, May 2, 2022)
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The software-defined vehicle needs hardware that goes the distance
(Thursday, April 28, 2022)
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Renesas Debuts Automotive ECU Virtualization Solution Platform to Enable Secure Integration of Multiple Applications for Zone ECU
(Monday, April 25, 2022)
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Imagination and Ambarella partner on autonomous vehicle human-machine interface visualisations with ASIL functional safety
(Sunday, April 24, 2022)
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Agnisys Announces ISO 26262 and IEC 61508 Qualification for Entire IDesignSpec Suite - SoC Specification Automation Flow
(Monday, April 18, 2022)
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Automotive Functional Safety with DCD's CAN ALL IP Core
(Wednesday, April 13, 2022)
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Virtual development environment for fast automotive application software development
(Tuesday, April 12, 2022)
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What Drives Autonomous Vehicles?
(Tuesday, April 5, 2022)
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Silicon Creations' Engineering Team Completes Training for Automotive Quality Certification
(Tuesday, April 5, 2022)
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Arteris IP FlexNoC Interconnect and Resilience Package Licensed in Neural Network Accelerator Chip Project Led by BMW Group
(Monday, April 4, 2022)
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Microcontrollers Get a Lift from Automotive After 2021 Rebound
(Tuesday, March 29, 2022)
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Andes and IAR Systems Enable Leading Automotive-Focused IC Design Companies to Accelerate Time to Market
(Monday, March 21, 2022)
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CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs
(Sunday, March 20, 2022)
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Rambus Accelerates Automotive SoC Design with ASIL-B Certified Embedded Hardware Security Module
(Wednesday, March 9, 2022)
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The Future of Automotive Connectivity
(Tuesday, March 8, 2022)
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Raising the Bar on Autonomous Vehicle Safety
(Wednesday, February 23, 2022)
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Audi is bringing 5G connectivity to its vehicles in 2024
(Monday, February 21, 2022)
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Arm Advances Adoption of ADAS, Automation Technologies
(Sunday, February 20, 2022)
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Arm introduces new automotive image signal processor to advance adoption of driver assistance and automation technologies
(Thursday, February 17, 2022)
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DCD-SEMI introduces secure & comprehensive CAN-ALL solutions for automotive
(Wednesday, February 16, 2022)
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EU allocates 6bn euros to satellite communication plan
(Tuesday, February 15, 2022)
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NSCore, Inc. Introduces its Automotive Grade-1 Qualified Non-Volatile Memory solution to help address the increasing need for Low Cost Semiconductor Chips
(Tuesday, February 1, 2022)
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CAES Collaborates with Lattice Semiconductor to Provide Radiation-Tolerant FPGAs for Distributed Satellite Computing Applications
(Sunday, January 30, 2022)
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The Real Reason Behind the Automotive Industry IC Shortage - A Step-Function Surge in Demand!
(Wednesday, January 26, 2022)
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Cadence Announces Full DRAM Verification Solution for Automotive, Data Center, and Mobile Applications
(Sunday, January 23, 2022)
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Siemens collaborates with UMC on design kits for automotive and power applications
(Wednesday, January 19, 2022)
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Faraday IP Solutions Certified by SGS-TUV for ISO 26262 ASIL-D Ready
(Monday, January 17, 2022)
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MIPI Alliance Releases A-PHY v1.1, Doubling Maximum Data Rate and Adding New Implementation Options to Automotive SerDes Interface
(Monday, January 17, 2022)
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Mercedes Applies Neuromorphic Computing in EV Concept Car
(Monday, January 17, 2022)
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Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems
(Sunday, January 16, 2022)
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Industry's First use of TLM for the At-Speed Verification of a PCIe-Based Avionics Design Requiring DO-254 Compliance
(Tuesday, January 11, 2022)
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VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving
(Tuesday, January 11, 2022)
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Gowin Automotive-grade FPGAs Pass SAIC's 2500h Heat Resistance Tests
(Thursday, December 16, 2021)
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BMW Group Signs Agreement with Inova Semiconductor and GlobalFoundries to Secure Supply
(Wednesday, December 8, 2021)
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BMW, GloFo sign chip supply agreement
(Tuesday, December 7, 2021)
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