Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.
www.eetasia.com, Apr. 01, 2021 –
Announcements involving advanced packaging architectures for semiconductor devices have multiplied in recent years. These architectures offer product designers tremendous flexibility and enable significant performance enhancements by heterogeneously integrating different IP elements – optimized on different silicon processes – on a single package.
Recent interest in advanced packaging is driven by the need for increased on-package bandwidth, the need to integrate diverse intellectual property from multiple foundries, and the need for improved yield resiliency. Organic packages are excellent mainstream platforms for heterogeneous integration, offering space transformation in compact form factors and increasingly power-efficient, high-bandwidth physical on-package interconnects.