TSMC details process technologies that will be used for billions of chips
www.techradar.com, Aug. 31, 2020 –
Taiwan Semiconductor Manufacturing Co. (TSMC) recently shared some details about its progress and plans for the coming years.
TSMC will continue to introduce new leading-edge manufacturing processes annually; 5nm chips this year and 3nm processors in late 2022.
For customers that need more than a leading-edge node, meanwhile, TSMC will offer new packaging technologies that will enable to create ultra-compact SiPs, as well as behemoth-sized SoCs for supercomputers.