www.spglobal.com, Jul. 14, 2020 –
Taiwan Semiconductor Manufacturing Co. Ltd. is pushing a new, experimental chip architecture to build super-advanced 2-nanometer chips for commercial production by 2023 or 2024, according to the Chinese-language publication Economic Daily.
TSMC previously announced plans to produce a 3-nm chip in 2021.
TSMC manufactures chips for U.S. companies, including Advanced Micro Devices Inc., which gained a technological lead over rival Intel Corp. by using TSMC's process to produce 7-nm chips for AMD's Ryzen CPUs. Intel's most advanced chips currently use a 10-nm process. Shrinking the process size of advanced chips reduces the space and electricity required while increasing the computing power of the end product.
TSMC announced in April that it was working on both 3-nm and 4-nm chip process sizes and would go into production at 3 nanometers during 2021. The company's 3-nm and 4-nm chips rely on an advanced but widely used design called finFET that provides a high level of control over whether power flows to a transistor.