wccftech.com, Feb. 03, 2025 –
It seems like TSMC doesn't look to stop its semiconductor ambitions, as the Taiwan giant is now determined to scale up process tech, to incorporate the cutting-edge 1nm process.
TSMC's 1nm Process Is Expected To Debut By 2030, Taiwan Giant Plans To Take Moore's Law To New Extents
There's no denying that TSMC has evolved to be the biggest foundry in the world right now, with no serious competition at all. The gap between other foundries widened when TSMC managed to grasp a significant share of NVIDIA's AI orders, giving Samsung and Intel Foundry no chance to put up some kind of challenge. According to a report from Taiwan Economic Daily, TSMC is planning to disrupt market competition by preparing for 1nm production lines in a new state-of-the-art facility.
The report mentions that TSMC's 1nm node is expected to be mass-produced in a dedicated facility in Tainan, Taiwan. The fab is said to be labeled as "Fab 25" and is expected to produce 12-inch wafers, that too with six production lines. Apart from 1nm, TSMC also plans to build new facilities for its upcoming 2nm and 1.4nm processes as well, that too in Tainan, since the region favours the firm in terms of incentives provided by the government, and how it is evolving to be a semiconductor-focused "Silicon Valley".
Let's take a brief look at TSMC's 1nm process. Back at the IEDM conference, TSMC shared its plans to develop the 1nm node by 2030. Interestingly, the firm showed optimism about integrating a whopping "trillion transistors" into the process through multiple 3D-stacked chipsets. TSMC has sort of changed its naming scheme after 2nm, with 1.4nm and 1nm processes being labeled as A14 and A10, showing some resemblance with Intel Foundry...