Dec. 17, 2024 – Fraunhofer IAF is expanding its technological capabilities in the field of III-V compound semiconductors, making a valuable contribution to the development of the APECS pilot line within the framework of the EU Chips Act. The Baden-Württemberg Ministry of Economic Affairs, Labour and Tourism is contributing 4.35 million euros to the funding. On 16 December 2024, State Secretary for Economic Affairs Dr. Patrick Rapp symbolically handed over a cheque for the funding amount to the institute’s directors. APECS will make it possible to further expand the research and development infrastructure across Europe over the next 4.5 years. The substantial total funding amounts to 730 million euros, provided by Chips Joint Undertaking, the Federal Ministry of Education and Research (BMBF) and other funding.
As part of the pilot line “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS), the Fraunhofer Institute for Applied Solid State Physics IAF will continue to expand its semiconductor research infrastructure in the coming years. It will receive support from the state of Baden-Württemberg in the form of national funding amounting to 4.35 million euros.
On 16 December 2024, State Secretary Dr. Patrick Rapp from the Baden-Württemberg Ministry of Economic Affairs, Labour and Tourism visited Fraunhofer IAF and symbolically handed over a cheque for the funding amount. Afterwards, the State Secretary for Economic Affairs was informed on site about the planned measures and the APECS pilot line, which will be coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD) over the next 4.5 years.