electronics360.globalspec.com, Nov. 10, 2021 –
Taiwan Semiconductor Manufacturing Corp. (TSMC) said its new Japanese fab will have an initial capital expenditure estimate of about $7 billion with Japanese government support.
TSMC confirmed it would be building the fab with a likely production start date by late 2024 earlier this year. The new details include the establishment of a new subsidiary called Japan Advanced Semiconductor Manufacturing Inc. (JASM) with the fab being built in Kumamoto, Japan, to provide foundry services to the region.
Initial technology at the fab will be in the 22/28 nanometer process technology and Sony Semiconductor Solutions (SSS) will take a minority stake in the Kumamoto facility with an investment of $500 million, a less than 20% equity stake in JASM.
Construction on the fab is expected to begin in 2022 and to directly create about 1,500 high tech jobs and have a monthly production capacity of 45,000 12 inch wafers.