D&R News Alert
March 6th, 2025
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Welcome to the issue of March 6th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Foundry News
■ Broadcom, NVIDIA Reportedly Running Test Chips Through Intel's Foundry Business
■ indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
What is new on FDSOI?
Design Platforms
■ Marvell Demonstrates Industry's Leading 2nm Silicon for Accelerated Infrastructure
■ Pragmatic Semiconductor launches next-generation platform for mixed-signal flexible ASIC design with early-access programme
■ How the Ability to Manage Register Specifications Helps You Create More Competitive Products - By Agnisys
Innosilicon
Highest Bandwidth Memory-Interface Solution Provider

◻ Strong partnership with all major foundries
◻ 19 years history & shipping 10 billion+ high-end SoCs
◻ PPA-optimized IPs - HPC/AI, Automotive, Low-Power IoT
◻ 3DIC, GDDR, LPDDR, DDR, HBM, UCIe, PCIe, PVT, Chiplet

Learn more >>

Analog IP
■ Omni Design Technologies Extends Swift™ Data Converter Solutions for FR1 and FR2 5G Subsystems
RISC-V
■ Semidynamics' Aliado SDK Accelerates AI Development for RISC-V with Seamless ONNX Integration
■ Quintauris launches the first RISC-V profile for today's real-time automotive applications
■ Jim Keller joins ex-Intel chip designers in RISC-V startup focused on breakthrough CPUs
Secure-IC
Secure-IC at WorldWide top events: Embedded World 2025
  • Securyzr™ iSE S500 neo series for chiplets
  • Securyzr™ Server for asset management, security monitoring, and secure updates
  • Analyzr™ for post-silicon security evaluation and PQC-readiness testing
  • Laboryzr™ our advanced analytics suite for security evaluation and certification support

Internet of Things
■ Ceva and Sharp Collaborate on "Beyond 5G" IoT Terminals
■ STMicroelectronics Announces Two New Generations of Microcontrollers (MCUs) for IoT Devices
Products
 ❖ Intelligent Sensor and Power Management Platform of ASIC IP for Sensor, Power, and IoT Applications

Artificial Intelligence
■ AONDevices Partners with Faraday to Enhance Production Capabilities
■ EMASS and Weebit Nano collaborate on ultra-low-power edge AI demonstration using ReRAM
■ MosChip® Launches MosChip DigitalSky GenAIoT™ to Accelerate the Development of Next-Gen Connected, Intelligent Products
Join us at Embedded World 2025, Hall 4, 4-612
New Solutions to Enhance Your SoC’s Yield,
Performance & Security
Book Meeting,
Meet us at EW25

• SRAM Repair Toolset : Seamlessly integrates Tessent MemoryBIST with NeoFuse OTP for advanced SoC.

• PUFhsm: Hardware Security Module with a CPU for secure boot, updates,
deployment, debugging, monitoring, key management, and lifecycle management.

Security
■ Guarding against the threat of clock attacks with analog IP - by Agile Analog
Quantum Computing
■ Quantware raises €20m for 1m qubit quantum computer
Rambus
Meet Rambus at Embedded World 2025

• See live demos of our CXL 2.0 and PCIe 6.0 IP
• Our experts will be presenting on Quantum Safe Cryptography and MIPI solutions for ADAS applications
• Visit us in Hall 4, Booth #632 and chat with our Security and Interface IP teams about our IP solutions
View the schedule and learn more >>

Partner News
■ Silvaco Expands Product Offering with Acquisition of Cadence’s Process Proximity Compensation Product Line
■ Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
■ Weebit Nano accelerates commercial activity through a licence with onsemi
Business News
■ Arm vs. Qualcomm: The Legal Tussle Continues






HBM3 PHY IP for TSMC N7
• Low latency, small area, low power
• Compatible with JEDEC standard HBM3 DRAMs

New IP
• Clock Attack Monitor TSMC by Agile Analog
• Smart Network-on-Chip (NoC) IP by Arteris
• SNOW-V Stream Cipher Engine by CAST
• LVDS IO in SMIC 28HKC+, upto 1.6Gbps by Brite Semiconductor

What they said at
IP SoC EU 24

Porting ASIC IP Cores to FPGA: It's Not a Cakewalk!
Philipp Jacobsohn, Principal Application Engineer, SmartDV Technologies

Integrated Security Solutions: How SRAM-based PUF Augments Embedded Hardware Secure Modules in a Post-Quantum World
Erik van der Sluis, Principal R&D Engineer, Synopsys, Inc.

How to Enhance Energy Efficiency and Reduce Costs with Advanced In-Situ Sensors?
Vincent Telandro, Product Marketing Manager, Dolphin Semiconductor

Niche gets super niche in the SEMI conductor Equipment domain
P SRINIVASA RAGHAVAN, Practice Head, Semiconductor BU, HCL TECH

Protecting Automotive Networks with MACsec Security
Bart Stevens, Senior Director of Product Marketing, Rambus, Inc.

Cyber Resilience and Safety in Automotive: How Security IP Provides Essential Primitives for Compliance
Gordon Fairley, Kudelski IoT

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