D&R News Alert
February 27th, 2025
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Welcome to the issue of February 27th, 2025 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

Secure-IC
Secure-IC at WorldWide top events: Mobile World Congress 2025

Memory IP
■ Attopsemi Expands its Proven I-fuse® OTP Portfolio on X-FAB’s 180nm Platform
■ Intel, Synopsys, TSMC All Unveil Record Memory Densities The move to nanosheet transistors is a boon for SRAM
Design Platform
■ Arteris Releases the Latest Generation of Magillem Registers to Automate Semiconductor Hardware/Software Integration
Proven ISO 26262 ASIL-Ready IP Cores from CAST
CAST

• RISC-V Embedded uP, CAN CC/FD/XL, LIN
• SENT/SAE J2716, 10BASE-T1S, & new SafeSPI
Plus TSN endpoints & switch, UDP/TCP/IP stacks, and more

Processor IP
■ Imagination takes efficiency up a level with latest D-Series GPU IP
Products
 ❖ Imagination DXTP GPU

RISC-V
■ Andes Technology and proteanTecs Partner to Bring Performance and Reliability Monitoring to RISC-V Cores
■ Baya Systems and Semidynamics Collaborate to Accelerate RISC-V System-on-Chip Development
FlexGen™ – smart NoC IP
Revolutionizing complex SoC design with
smart NoC IP from Arteris
 ■ 10x Productivity Boost
■ Expert-Level Results
■ Up to 30% Wire Length Reduction

Learn about FlexGen Download tech paper Watch video

Artificial Intelligence
■ BrainChip Collaborates with Onsor Technologies To Power Epileptic Seizure-Detecting Glasses
■ sureCore PowerMiser IP enables KU Leuven chip for AI applications to achieve dynamic power saving of greater than 40%
■ Q.ANT and IMS CHIPS Launch Production of High-Performance AI Chips, Establish Blueprint for Strengthening Chip Sovereignty
■ Dnotitia and Finders Establish Strategic Partnership to Develop AI-driven Insurance Solution
■ VeriSilicon unveils low-power AI Noise Reduction and AI Super Resolution IPs
Automotive
■ Cortus MINERVA Out-of-Order 4GHz 64-bit RISC-V Processor Platform targets automotive applications
Xiphera
xQlave® PQC (ML-KEM and ML-DSA)

• Quantum-secure key exchange and digital signatures
• Efficient, low-latency performance for embedded systems
• Pure digital logic with no CPU or software components
• Easy integration into existing hardware architectures
 Learn more >>
Meet us at Embedded World – Booth #4-137

Security
■ Interview with Xiphera CEO - Adapting to Market Changes
eFPGA
■ QuickLogic Announces $1.1M eFPGA IP Contract with new Defense Industrial Base Customer
Webinar: Synopsys Collaboration Framework to Boost SoC/Chiplet Architecture Performance Analysis and Optimization
Synopsys

Join to discover how Synopsys Platform Architect Development Kits (PADKs) are revolutionizing SoC/Chiplet architecture performance analysis and optimization.
Date: March, 13 - 9 a.m. PST
Speaker: Holger Keding, Solutions Application Engineer, Synopsys

Register Now >>

Quantum Computing
■ Socionext Announces Strategic Partnership with Google Quantum AI in Quantum Computing Development
■ PsiQuantum Announces Omega, a Manufacturable Photonic Quantum Computing Chipset
Green Electronics
■ Sustainable design is an evolution of industrial design
Partner News
■ Quadric Announces Lee Vick is New VP Worldwide Sales
■ Meet T2M @ MWC 2025 to learn about Cutting-Edge RF, Wireless, Automotive Semiconductor IP Cores & ASIC services
■ 2025 Outlook with Paul Wells of sureCore





New IP
• Ultra low-power crystal-based 32 kHz oscillator designed in TSMC 12FFC+ by Dolphin Semiconductor
• MIPI C-PHY DSI TX (Transmitter/Host) IP in TSMC 22ULL by Mixel
• Post-quantum secure root of trust subsystem by PQShield
• 14-bit, 2.4 GSPS High Performance Swift™ DAC in 16nm CMOS by Omni Design Technologies
• 1.8V & 3.3V Radiation Hardened GPIO with Optimized LDO by Certus Semiconductor
• 112G Ethernet PHY IP for TSMC N6 by Synopsys

What they said at
IP SoC EU 24

Silicon Lifecycle Management (SLM) in context of Chiplets for Automotive
Graham Woods, Principal Product Manager, Synopsys, Inc.

Solidify the European FDSOI ecosystem and accelerating its industrial deployment; A Chips JU initiative
Martin LABRUNE, European & France Public Affairs, STMicroelectronics

Designing Intelligence from our SOIL
Krishna Pradeep, Soitec

Interview with Jean-Christophe Brignone - SMTS - STMicroelectronics

Interview with Hakim Jaafar - VP Marketing - Dolphin Semiconductor

Interview with Graham Woods - Principal Product Manager - Synopsys, Inc.

Interview with Gordon Fairley - Kudelski IoT

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